| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU3P-1FFVB676C | Kintex® UltraScale+ | 20,34 | -1,00 | 355,950 LE | 31,641,600 bits | 272 | 0.850 V | Surface Mount | -40 °C – 100 °C | FCBGA-676 | 676-FCBGA (27×27) |
XCKU3P-1FFVB676C
Manufacturer: Xilinx
Logic Cells: 3,780,000
Logic Slices: 590,000
Embedded RAM (eRAM): 81,360 Kb (2,260 × 36Kb Block RAM)
Maximum User I/O: 350
Package: FFVB676 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Commercial (0°C to +85°C)
