AMPAK – Wireless Connectivity Modules
LXB Semicon distributes AMPAK’s Wi-Fi and Bluetooth modules for consumer, industrial, and IoT applications. Original brand sourcing only — traceable, compliant, and non-commodity distribution.
| Mfr Part | Datasheet | Manufacturer | Wi-Fi Standard | Bluetooth Version | Frequency Band(s) | Max Wi-Fi Data Rate | Interfaces | Dimensions | Operating Temp. | Certifications | Typical Applications |
| AP6256 | AMPAK Technology Inc. | 802.11 a/b/g/n/ac (Wi-Fi 5) | Bluetooth 5.4 | 2.4 & 5 GHz | Up to 433.3 Mbps | SDIO (Wi-Fi); UART (BT) | 12 × 12 mm (typ.) | −30 °C to +85 °C | FCC, CE, TELEC, SRRC, BQB | Tablets, OTT boxes, portable devices, IoT hubs | |
| AP6212 | AMPAK Technology Inc. | 802.11 b/g/n (Wi-Fi 4) | Bluetooth 5.4 | 2.4 GHz | Up to ~72.2 Mbps | SDIO (Wi-Fi); UART (BT) | 12 × 12 mm | −30 °C to +85 °C | FCC/CE pre-scan, BQB | Portable devices, embedded Wi-Fi + BT | |
| AP6212-A1 | AMPAK Technology Inc. | (same as AP6212) | (same as AP6212) | 2.4 GHz | ~72.2 Mbps | SDIO (Wi-Fi); UART (BT) | 12 × 12 mm | −30 °C to +85 °C | FCC/CE pre-scan, BQB | Portable & embedded wireless products |

