XC7K70T-2FBG676E

Manufacturer: Xilinx
Logic Cells: 70,400
Logic Slices: 11,000
Embedded RAM (eRAM): 4,680 Kb (130 × 36Kb Block RAM)
Maximum User I/O: 400
Package: FBG676 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K70T-2FBG676E Kintex-7 5.125,00 -2,00 65,600 4976640 300 0.97 – 1.03 V (typ 1.0 V) Surface mount 0 °C — 100 °C FBG-676 (27×27 mm) 676-FCBGA