| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K70T-2FBG676E | 킨텍스-7 | 5.125,00 | -2,00 | 65,600 | 4976640 | 300 | 0.97 - 1.03V(통상 1.0V) | 표면 실장 | 0°C - 100°C | FBG-676(27×27mm) | 676-FCBGA |
사양
Part Number Explanation
This is a wide-temperature industrial-grade mid-density FPGA belonging to Xilinx Kintex-7 family, built on mature 28nm process technology. It delivers balanced logic performance, abundant I/O expandability and stable low power consumption, targeted at industrial automation, wired communication and portable test devices working under harsh wide-temperature environments.
- XC7K70T: Mid-range density chip of Kintex-7 series, T stands for low-power optimized version
- -2: Speed Grade 2, mainstream balanced timing grade. It reserves sufficient timing allowance for most industrial digital logic designs, striking a balance between operating frequency, timing stability and overall power consumption
- FBG676: 676-ball flip-chip BGA package, larger pin count brings more configurable user I/O resources for multi-peripheral extended design
- E: 확장 산업용 온도 등급, 작동 접합 온도 범위: -40°C ~ +100°C
On-Chip Hardware Resource Details
1. 일반 논리 관련 자료
- Total Logic Cells: 70800
- Available Slices: 11060
- Total Flip-Flops: 88480
- Total LUTs: 44240
2. Arithmetic and Storage Resources
- DSP48E1 arithmetic units: 240 units, used for FFT computation, digital filtering, motor control algorithms, signal convolution and mathematical operation acceleration
- Total Block RAM capacity: 3780 Kb, applied for data buffering, FIFO queues and local parameter storage
- Distributed RAM capacity: 1188 Kb
3. Clock Management Resources
- 6 MMCM clock management tiles
- 6 PLL phase-locked loops
Supports multi-domain clock generation, clock phase adjustment and high-frequency jitter suppression to meet synchronous timing demands of multi-module systems
4. 고속 직렬 트랜시버
- 8 channels of GTX high-speed serial transceivers
Maximum line rate reaches 6.6Gbps, compatible with PCIe Gen2, Aurora, CPRI, Gigabit Ethernet and other mainstream serial communication protocols
5. I/O Interfaces and On-Chip Monitoring Module
- 구성 가능한 사용자 I/O 핀: 400
I/O bank voltage adjustable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL and common differential signal standards
Dual-channel 12-bit XADC analog monitor is integrated on chip, realizing real-time detection of die junction temperature, internal power supply voltages and external analog input signals
Power Supply Specifications
Nominal core internal voltage: 1.0V
Independent power domains are configured for logic area, block RAM and high-speed transceivers respectively
Typical overall power consumption: 3.5W ~ 13W; passive heat dissipation can fulfill long-term continuous operation requirements under conventional industrial loads
Packaging & SMT Assembly Requirements
- Package type: 676-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be completed within 168 hours after vacuum packaging is opened
- Lead-free structure, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays for automated PCB mass production
Environmental Adaptability and Reliability
The chip can operate stably and continuously under wide temperature fluctuations, mechanical vibration and moderate electromagnetic interference industrial environments. It supports bitstream encryption protection and SEU single-event upset error detection, featuring strong anti-interference and high operational reliability for field rugged devices.
일반적인 애플리케이션 시나리오
- Multi-axis industrial motion controllers, servo drive main control boards
- Industrial Ethernet converters, multi-channel fieldbus protocol gateway modules
- Portable vibration acquisition analyzers, on-site environmental monitoring terminals
- Small base station baseband auxiliary processing boards, wireless signal forwarding units
- Medical device data acquisition and logic control modules
- Wide-temperature industrial core boards and embedded algorithm verification platforms
