XC7K70T-2FBG676E

Manufacturer: Xilinx
Logic Cells: 70,400
Logic Slices: 11,000
Embedded RAM (eRAM): 4,680 Kb (130 × 36Kb Block RAM)
Maximum User I/O: 400
Package: FBG676 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K70T-2FBG676EKintex-75.125,00-2,0065,60049766403000.97 – 1.03 V (typ 1.0 V)Surface mount0 °C — 100 °CFBG-676 (27×27 mm)676-FCBGA