| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU13P-1FHGC2104E | XCVU13P | 216.000,00 | -1,00 | 3780000 | 514867200 | 416 | ~0.698-0.876 V | Oberflächenmontage | Erweitert (0°C~100°C typisch für einige Auflistungen) | 2104 FCBGA | 2104-FCBGA |
XCVU13P-1FHGC2104E
Hersteller: Xilinx
Logische Zellen: 13,140,000
Logische Schnitte: 2,050,000
Eingebettetes RAM (eRAM): 94,320 Kb (2,620 × 36Kb Block RAM)
Maximale Benutzer-E/A: 800
Paket: FHGC2104 (Flip-Chip BGA)
Geschwindigkeitsstufe: -1
Betriebstemperatur: Erweitert (0°C bis +100°C)
Spezifikationen
Definition der Artikelnummer
This extended temperature low-power FPGA belongs to Virtex UltraScale+ series, manufactured with 16nm FinFET advanced process. It adopts power-optimized chip architecture, retains complete logic, computing, storage and high-speed transceiver resources, and is designed for indoor data center communication boards, laboratory high-speed test instruments, stationary chip verification platforms and indoor industrial high-throughput computing equipment working under stable ambient temperature conditions.
- XCVU13P: Mid-high capacity mainstream device of Virtex UltraScale+ product line. The suffix P stands for power-optimized version, which greatly optimizes power consumption efficiency and on-chip interconnection delay compared with standard models
- -1: Speed Grade 1, low-power priority timing grade. Thermal balance and power saving are the core design goals instead of pursuing maximum operating frequency, suitable for long-term continuous running equipment with limited heat dissipation conditions
- FHGC2104: 2104-ball flip-chip FCBGA package. Adequate ball pins support full layout of all GTY high-speed transceivers, large-capacity general-purpose I/O wiring and multi-channel DDR4 memory interface docking while controlling overall equipment volume
- E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C
On-Chip Hardware Resource Specifications
1. Programmable Logic Resources
- Total System Logic Cells: 3780000
- Configurable CLB Slices: 216000
- Total Flip-Flops: 3456000
- Total LUT Lookup Tables: 1728000
- Distributed RAM Capacity: 18.6 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E3 arithmetic slices: 12288 units, supports high-precision fixed-point and floating-point computing, large-scale FFT operation, communication baseband processing, radar signal analysis and cryptographic algorithm acceleration, applicable to massive matrix calculation tasks
- Total Block RAM Capacity: 94.5 Mb, used for large-capacity image frame buffering, deep-depth FIFO data cache, waveform data storage and algorithm parameter storage tables
- Embedded UltraRAM: 360 Mb, used for large-capacity on-chip high-speed buffer storage
3. Clock Management Subsystem
- 16 MMCM clock management tiles
- 16 PLL phase-locked loops
Users can build multiple mutually independent clock domains freely, realize accurate clock phase adjustment, signal transmission delay compensation and ultra-low jitter suppression, fully meeting strict synchronous timing requirements of ultra-large complex digital systems
4. Serielle Hochgeschwindigkeits-Transceiver
- 76 channels of GTY differential high-speed transceivers
Each lane maximum transmission rate reaches 32.75 Gbps, compatible with PCIe Gen4, 100G/200G Ethernet, Aurora, JESD204B and all mainstream high-speed serial communication protocols. Built-in hard Ethernet MAC and PCIe controller IP greatly shorten high-bandwidth interface development cycle
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 702
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended and differential signal standards
The built-in system monitoring module continuously collects real-time data of chip junction temperature, internal power supply voltages and external analog input signals
Power Supply Characteristics
The core operating voltage of Speed Grade 1 is optimized for low power consumption, ranging from 0.82V to 0.88V. Programmable logic area, block RAM, UltraRAM, DSP arrays and serial transceivers are divided into independent power domains, supporting partial module power gating to dynamically reduce overall power consumption
Typical total power consumption ranges from 26W to 68W. For stable full-load continuous operation under the upper temperature limit, forced air cooling system is required
Packaging and SMT Assembly Requirements
- Package form: 2104-pin FCBGA flip-chip ball grid array, overall size 52.5mm × 52.5mm
- Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly production
Environmental Adaptability and Operational Reliability
This chip is customized for indoor constant-temperature working environments. It can run reliably for a long time under mild temperature fluctuation, slight mechanical vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, without radiation-hardened reinforcement design, and cannot adapt to outdoor low-temperature and severe rugged application scenarios
Typische Anwendungsszenarien
- Large-scale ASIC and SoC hardware prototype verification platforms and digital logic emulation equipment deployed in laboratory server rooms
- 200G high-density optical communication line cards, data center switching and routing core processing boards
- Desktop ultra-wideband signal analyzers, multi-channel arbitrary waveform generators and high-speed data acquisition instruments
- Indoor large industrial machine vision inspection systems and real-time high-resolution image processing equipment
- High-performance computing acceleration cards and server internal high-speed data interconnection modules
- Research-oriented algorithm development platforms for university electronic engineering and communication majors
