xcvu13p-1fhgc2104e

تعريف رقم القطعة

1. XCVU13P: Mid-high capacity mainstream device of Virtex UltraScale+ product line. The suffix P stands for power-optimized version, which greatly optimizes power consumption efficiency and on-chip interconnection delay compared with standard models
2. -1: Speed Grade 1, low-power priority timing grade. Thermal balance and power saving are the core design goals instead of pursuing maximum operating frequency, suitable for long-term continuous running equipment with limited heat dissipation conditions
3. FHGC2104: 2104-ball flip-chip FCBGA package. Adequate ball pins support full layout of all GTY high-speed transceivers, large-capacity general-purpose I/O wiring and multi-channel DDR4 memory interface docking while controlling overall equipment volume
4. E: Extended commercial temperature grade, continuous junction temperature operating range: 0°C ~ +100°C

On-Chip Hardware Resource Specifications

1. Programmable Logic Resources

• Total System Logic Cells: 3780000
• Configurable CLB Slices: 216000
• Total Flip-Flops: 3456000
• Total LUT Lookup Tables: 1728000
• Distributed RAM Capacity: 18.6 Mb

2. موارد الحساب والذاكرة المدمجة

• DSP48E3 arithmetic slices: 12288 units, supports high-precision fixed-point and floating-point computing, large-scale FFT operation, communication baseband processing, radar signal analysis and cryptographic algorithm acceleration, applicable to massive matrix calculation tasks
• Total Block RAM Capacity: 94.5 Mb, used for large-capacity image frame buffering, deep-depth FIFO data cache, waveform data storage and algorithm parameter storage tables
• Embedded UltraRAM: 360 Mb, used for large-capacity on-chip high-speed buffer storage

3. Clock Management Subsystem

• 16 MMCM clock management tiles
• 16 PLL phase-locked loops

  Users can build multiple mutually independent clock domains freely, realize accurate clock phase adjustment, signal transmission delay compensation and ultra-low jitter suppression, fully meeting strict synchronous timing requirements of ultra-large complex digital systems

4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة

• 76 channels of GTY differential high-speed transceivers

  Each lane maximum transmission rate reaches 32.75 Gbps, compatible with PCIe Gen4, 100G/200G Ethernet, Aurora, JESD204B and all mainstream high-speed serial communication protocols. Built-in hard Ethernet MAC and PCIe controller IP greatly shorten high-bandwidth interface development cycle

5. I/O Interfaces and System Monitoring Module

• Configurable user I/O pins: 702

  Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended and differential signal standards

  The built-in system monitoring module continuously collects real-time data of chip junction temperature, internal power supply voltages and external analog input signals

Power Supply Characteristics

Packaging and SMT Assembly Requirements

• Package form: 2104-pin FCBGA flip-chip ball grid array, overall size 52.5mm × 52.5mm
• Moisture Sensitivity Level: MSL4. All reflow soldering procedures must be completed within 72 hours after vacuum packaging is opened
• Lead-free packaging design, fully compliant with RoHS environmental standards
• Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly production

Environmental Adaptability and Operational Reliability

سيناريوهات التطبيق النموذجية

1. Large-scale ASIC and SoC hardware prototype verification platforms and digital logic emulation equipment deployed in laboratory server rooms
2. 200G high-density optical communication line cards, data center switching and routing core processing boards
3. Desktop ultra-wideband signal analyzers, multi-channel arbitrary waveform generators and high-speed data acquisition instruments
4. Indoor large industrial machine vision inspection systems and real-time high-resolution image processing equipment
5. High-performance computing acceleration cards and server internal high-speed data interconnection modules
6. Research-oriented algorithm development platforms for university electronic engineering and communication majors