| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K480T-2FFG901E | Kintex-7 | 37.325,00 | -2,00 | 477,760 | 35205120 | 380 | 0.97 - 1.03 | Oberflächenmontage | 0 °C ... +100 °C (E) | FCBGA-901 (FFG901) | 901-FCBGA (31×31) |
XC7K480T-2FFG901E
Hersteller: Xilinx
Logische Zellen: 477,760
Logische Schnitte: 74,650
Eingebettetes RAM (eRAM): 33.840 Kb (940 × 36Kb Block RAM)
Maximale Benutzer-E/A: 400
Paket: FFG901 (Flip-Chip BGA)
Geschwindigkeitsstufe: -2
Betriebstemperatur: Erweitert (0°C bis +100°C)
Spezifikationen
Definition der Artikelnummer
This is a large-capacity extended industrial temperature FPGA from Xilinx Kintex-7 series, built on proven 28nm semiconductor manufacturing process. It integrates abundant logic, DSP and embedded memory resources inside a compact footprint package, optimized for miniaturized rugged embedded devices that demand powerful parallel computing capability, wide-temperature stability and limited equipment installation space.
- XC7K480T: Top-tier high-density model of Kintex-7 family; the suffix T denotes low-power optimized silicon die
- -2: Speed Grade 2, the most widely adopted balanced timing grade. It reserves sufficient timing margin for large-scale high-frequency digital circuit design, striking an optimal balance between maximum operating frequency, timing closure reliability and overall power consumption
- FFG901: 901-ball flip-chip FCBGA compact package. Smaller overall size facilitates hardware miniaturization design while retaining adequate I/O and peripheral expansion resources
- E: Extended industrial temperature range, operating junction temperature: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. General Programmable Logic Resources
- Total Logic Cells: 485,760
- Configurable Slices: 75,900
- Total Flip-Flops: 607,200
- Total LUTs: 303,600
2. Rechen- und Speicherressourcen
- DSP48E1 arithmetic units: 1,920 pieces, applicable to massive FFT operations, digital filtering, radar signal demodulation, multi-channel HD video algorithm acceleration and large matrix mathematical calculations
- Total Block RAM capacity: 34,290 Kb, used for image frame buffering, deep FIFO data caching, waveform storage and algorithm parameter lookup tables
- Distributed RAM capacity: 8,440 Kb
3. Clock Management Subsystem
- 12 MMCM clock management tiles
- 12 PLL phase-locked loops
Supports multi-clock domain generation, phase fine adjustment, clock delay compensation and high-frequency clock jitter suppression, satisfying strict synchronous timing requirements of ultra-large complex digital systems
4. Serielle Hochgeschwindigkeits-Transceiver
- 20 GTX high-speed differential transceivers
Maximum line rate reaches 10.3125 Gbps, compatible with PCIe Gen2, 10 Gigabit Ethernet, CPRI, JESD204B, Aurora and other mainstream high-speed serial communication protocols
5. I/O Interfaces & On-Chip Monitoring Module
- User configurable I/O pins: 444
I/O bank voltage can be configured from 1.2V to 3.3V, fully supporting LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
A dual-channel 12-bit XADC analog monitor is embedded on the chip, realizing real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
Technische Daten zum Netzteil
Nominal core logic operating voltage: 1.0V
Independent isolated power domains are set for logic fabric, Block RAM, DSP array and high-speed transceivers separately
Typical overall power consumption: 13W ~ 38W. Compact forced-air active cooling is required to maintain stable full-load operation under maximum temperature working conditions
Anforderungen an die Verpackung und die SMT-Bestückung
- Package form: 901-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering procedures must be finished within 72 hours after vacuum packaging is opened
- Lead-free packaging structure, fully compliant with RoHS environmental directives
- Stored and shipped in anti-static trays to avoid electrostatic damage during automated PCB mass production
Umweltverträglichkeit und Zuverlässigkeit
The chip can operate continuously and stably under severe temperature fluctuations, mechanical vibration, impact and moderate electromagnetic interference harsh industrial environments. It supports 256-bit AES bitstream encryption protection and SEU single-event upset detection and correction, with outstanding thermal robustness and anti-interference performance for long-term field deployment.
Typische Anwendungsszenarien
- Portable high-end spectrum analyzers, multi-channel high-speed oscilloscopes and transient signal recording devices
- Software-defined radio baseband processing units, miniaturized outdoor wireless communication main control boards
- Multi-channel industrial machine vision inspection systems, compact high-speed real-time image processing terminals
- Vehicle-mounted multi-sensor fusion computing hosts, automotive intelligent edge control equipment
- Light airborne radar signal preprocessing modules, flight data acquisition and forwarding units
- Wide-temperature high-performance industrial SOM core boards and ultra-complex embedded algorithm prototype verification platforms
