| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K480T-2FFG901E | 킨텍스-7 | 37.325,00 | -2,00 | 477,760 | 35205120 | 380 | 0.97 - 1.03 | 표면 실장 | 0°C ... +100°C (E) | FCBGA-901(FFG901) | 901-FCBGA(31×31) |
사양
부품 번호 정의
This is a large-capacity extended industrial temperature FPGA from Xilinx Kintex-7 series, built on proven 28nm semiconductor manufacturing process. It integrates abundant logic, DSP and embedded memory resources inside a compact footprint package, optimized for miniaturized rugged embedded devices that demand powerful parallel computing capability, wide-temperature stability and limited equipment installation space.
- XC7K480T: Top-tier high-density model of Kintex-7 family; the suffix T denotes low-power optimized silicon die
- -2: Speed Grade 2, the most widely adopted balanced timing grade. It reserves sufficient timing margin for large-scale high-frequency digital circuit design, striking an optimal balance between maximum operating frequency, timing closure reliability and overall power consumption
- FFG901: 901-ball flip-chip FCBGA compact package. Smaller overall size facilitates hardware miniaturization design while retaining adequate I/O and peripheral expansion resources
- E: Extended industrial temperature range, operating junction temperature: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. General Programmable Logic Resources
- Total Logic Cells: 485,760
- Configurable Slices: 75,900
- Total Flip-Flops: 607,200
- Total LUTs: 303,600
2. Arithmetic and Memory Resources
- DSP48E1 arithmetic units: 1,920 pieces, applicable to massive FFT operations, digital filtering, radar signal demodulation, multi-channel HD video algorithm acceleration and large matrix mathematical calculations
- Total Block RAM capacity: 34,290 Kb, used for image frame buffering, deep FIFO data caching, waveform storage and algorithm parameter lookup tables
- Distributed RAM capacity: 8,440 Kb
3. Clock Management Subsystem
- 12 MMCM clock management tiles
- 12 PLL phase-locked loops
Supports multi-clock domain generation, phase fine adjustment, clock delay compensation and high-frequency clock jitter suppression, satisfying strict synchronous timing requirements of ultra-large complex digital systems
4. 고속 직렬 트랜시버
- 20 GTX high-speed differential transceivers
Maximum line rate reaches 10.3125 Gbps, compatible with PCIe Gen2, 10 Gigabit Ethernet, CPRI, JESD204B, Aurora and other mainstream high-speed serial communication protocols
5. I/O Interfaces & On-Chip Monitoring Module
- User configurable I/O pins: 444
I/O bank voltage can be configured from 1.2V to 3.3V, fully supporting LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
A dual-channel 12-bit XADC analog monitor is embedded on the chip, realizing real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
전원 공급 장치 사양
Nominal core logic operating voltage: 1.0V
Independent isolated power domains are set for logic fabric, Block RAM, DSP array and high-speed transceivers separately
Typical overall power consumption: 13W ~ 38W. Compact forced-air active cooling is required to maintain stable full-load operation under maximum temperature working conditions
포장 및 SMT 조립 요건
- Package form: 901-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering procedures must be finished within 72 hours after vacuum packaging is opened
- Lead-free packaging structure, fully compliant with RoHS environmental directives
- Stored and shipped in anti-static trays to avoid electrostatic damage during automated PCB mass production
환경 적응성 및 신뢰성
The chip can operate continuously and stably under severe temperature fluctuations, mechanical vibration, impact and moderate electromagnetic interference harsh industrial environments. It supports 256-bit AES bitstream encryption protection and SEU single-event upset detection and correction, with outstanding thermal robustness and anti-interference performance for long-term field deployment.
일반적인 애플리케이션 시나리오
- Portable high-end spectrum analyzers, multi-channel high-speed oscilloscopes and transient signal recording devices
- Software-defined radio baseband processing units, miniaturized outdoor wireless communication main control boards
- Multi-channel industrial machine vision inspection systems, compact high-speed real-time image processing terminals
- Vehicle-mounted multi-sensor fusion computing hosts, automotive intelligent edge control equipment
- Light airborne radar signal preprocessing modules, flight data acquisition and forwarding units
- Wide-temperature high-performance industrial SOM core boards and ultra-complex embedded algorithm prototype verification platforms
