| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K480T-2FFG901E | Kintex-7 | 37.325,00 | -2,00 | 477,760 | 35205120 | 380 | 0.97 - 1.03 | Montaje en superficie | 0 °C ... +100 °C (E) | FCBGA-901 (FFG901) | 901-FCBGA (31×31) |
XC7K480T-2FFG901E
Fabricante: Xilinx
Células lógicas: 477,760
Rebanadas lógicas: 74,650
RAM integrada (eRAM): 33 840 Kb (940 × 36 Kb de RAM en bloques)
E/S máxima por usuario: 400
Paquete: FFG901 (BGA con chip invertido)
Grado de velocidad: -2
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Definición del número de pieza
This is a large-capacity extended industrial temperature FPGA from Xilinx Kintex-7 series, built on proven 28nm semiconductor manufacturing process. It integrates abundant logic, DSP and embedded memory resources inside a compact footprint package, optimized for miniaturized rugged embedded devices that demand powerful parallel computing capability, wide-temperature stability and limited equipment installation space.
- XC7K480T: Top-tier high-density model of Kintex-7 family; the suffix T denotes low-power optimized silicon die
- -2: Speed Grade 2, the most widely adopted balanced timing grade. It reserves sufficient timing margin for large-scale high-frequency digital circuit design, striking an optimal balance between maximum operating frequency, timing closure reliability and overall power consumption
- FFG901: 901-ball flip-chip FCBGA compact package. Smaller overall size facilitates hardware miniaturization design while retaining adequate I/O and peripheral expansion resources
- E: Extended industrial temperature range, operating junction temperature: -40°C ~ +100°C
Parámetros de los recursos de hardware integrados en el chip
1. Recursos generales sobre lógica programable
- Total de celdas lógicas: 485 760
- Segmentos configurables: 75 900
- Total de chanclas: 607 200
- Total de LUT: 303 600
2. Arithmetic and Memory Resources
- DSP48E1 arithmetic units: 1,920 pieces, applicable to massive FFT operations, digital filtering, radar signal demodulation, multi-channel HD video algorithm acceleration and large matrix mathematical calculations
- Total Block RAM capacity: 34,290 Kb, used for image frame buffering, deep FIFO data caching, waveform storage and algorithm parameter lookup tables
- Capacidad de RAM distribuida: 8 440 Kb
3. Clock Management Subsystem
- 12 bloques de gestión de reloj MMCM
- 12 PLL phase-locked loops
Supports multi-clock domain generation, phase fine adjustment, clock delay compensation and high-frequency clock jitter suppression, satisfying strict synchronous timing requirements of ultra-large complex digital systems
4. Transceptores seriales de alta velocidad
- 20 transceptores diferenciales de alta velocidad GTX
Maximum line rate reaches 10.3125 Gbps, compatible with PCIe Gen2, 10 Gigabit Ethernet, CPRI, JESD204B, Aurora and other mainstream high-speed serial communication protocols
5. Interfaces de E/S y módulo de monitoreo integrado en el chip
- User configurable I/O pins: 444
I/O bank voltage can be configured from 1.2V to 3.3V, fully supporting LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
A dual-channel 12-bit XADC analog monitor is embedded on the chip, realizing real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
Especificaciones de la fuente de alimentación
Nominal core logic operating voltage: 1.0V
Independent isolated power domains are set for logic fabric, Block RAM, DSP array and high-speed transceivers separately
Typical overall power consumption: 13W ~ 38W. Compact forced-air active cooling is required to maintain stable full-load operation under maximum temperature working conditions
Requisitos de empaque y ensamblaje SMT
- Package form: 901-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering procedures must be finished within 72 hours after vacuum packaging is opened
- Lead-free packaging structure, fully compliant with RoHS environmental directives
- Se almacenan y envían en bandejas antiestáticas para evitar daños electrostáticos durante la producción automatizada en masa de placas de circuito impreso
Adaptabilidad ambiental y confiabilidad
The chip can operate continuously and stably under severe temperature fluctuations, mechanical vibration, impact and moderate electromagnetic interference harsh industrial environments. It supports 256-bit AES bitstream encryption protection and SEU single-event upset detection and correction, with outstanding thermal robustness and anti-interference performance for long-term field deployment.
Escenarios típicos de aplicación
- Portable high-end spectrum analyzers, multi-channel high-speed oscilloscopes and transient signal recording devices
- Software-defined radio baseband processing units, miniaturized outdoor wireless communication main control boards
- Multi-channel industrial machine vision inspection systems, compact high-speed real-time image processing terminals
- Vehicle-mounted multi-sensor fusion computing hosts, automotive intelligent edge control equipment
- Light airborne radar signal preprocessing modules, flight data acquisition and forwarding units
- Wide-temperature high-performance industrial SOM core boards and ultra-complex embedded algorithm prototype verification platforms
