XCVU3P-1FFVC1517I

Manufacturer: Xilinx
Logic Cells: 3,780,000
Logic Slices: 590,000
Embedded RAM (eRAM): 81,360 Kb (2,260 × 36Kb Block RAM)
Maximum User I/O: 600
Package: FFVC1517 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCVU3P-1FFVC1517I XCVU3P 49,26 -1,00 862,050 LE 25300000 560 0.85 V typical SMD/SMT 0°C~110°C FBGA-1517 (1517 FCBGA) 1517-FCBGA