| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU3P-1FFVC1517I | XCVU3P | 49,26 | -1,00 | 862.050 LE | 25300000 | 560 | 0,85 V (giá trị điển hình) | SMD/SMT | 0°C~110°C | FBGA-1517 (1517 FCBGA) | 1517-FCBGA |
XCVU3P-1FFVC1517I
Nhà sản xuất: Xilinx
Tế bào logic: 3,780,000
Các lát cắt logic: 590,000
Bộ nhớ RAM tích hợp (eRAM): 81.360 Kb (2.260 × 36 Kb bộ nhớ RAM khối)
Dung lượng I/O tối đa của người dùng: 600
Gói: FFVC1517 (BGA lật chip)
Đánh giá tốc độ: -1
Nhiệt độ hoạt động: Công nghiệp (-40°C đến +100°C)
Thông số kỹ thuật
Định nghĩa mã sản phẩm
This industrial-grade low-power FPGA belongs to AMD Xilinx Virtex UltraScale+ family, fabricated on advanced 16nm FinFET process. It adopts power-optimized UltraScale+ architecture with streamlined on-chip resources, tailored for battery-powered portable field test terminals, miniature unmanned aerial vehicle payload modules, outdoor industrial sensor acquisition equipment and vehicle-mounted embedded preprocessing units that require reliable continuous operation across the full industrial temperature range.
- XCVU3P: Entry-level power-optimized device of Virtex UltraScale+ lineup. The suffix P denotes power-focused optimization, delivering lower static power consumption and optimized internal routing latency compared with standard variants
- -1: Speed Grade 1, low-power prioritized timing specification. Thermal balance and power saving are core design targets rather than maximum operating clock frequency, perfectly suited for continuously operated hardware with limited heat dissipation space
- FFVC1517: 1517-ball compact flip-chip FCBGA package with physical dimension 40mm × 40mm. Compact outline realizes equipment miniaturization, while reserved pins support full layout of integrated GTY transceivers, general-purpose I/O wiring and DDR4 memory interface docking
- I: Dải nhiệt độ công nghiệp, dải nhiệt độ hoạt động liên tục tại điểm nối: -40°C ~ +100°C
Các tham số tài nguyên phần cứng trên chip
1. Tài nguyên về logic lập trình
- Total System Logic Cells: 862050
- Configurable CLB Slices: 49260
- Total Flip-Flops: 985200
- Total LUT Lookup Tables: 492600
- Distributed RAM Capacity: 6.8 Mb
2. Các tài nguyên toán học và bộ nhớ nhúng
- DSP48E3 arithmetic blocks: 672 units, optimized for fixed-point and floating-point calculation, small-scale FFT spectrum analysis, sensor signal processing, lightweight cryptographic algorithm acceleration and small matrix computing tasks
- Total Block RAM Capacity: 14.76 Mb, utilized for image frame buffering, shallow FIFO data caching, waveform storage and algorithm parameter lookup tables
No UltraRAM memory is embedded inside this chip
3. Hệ thống con quản lý đồng hồ
- 10 MMCM clock management tiles
- 10 PLL phase-locked loops
Multiple independent clock domains can be flexibly configured to achieve precise clock phase adjustment, signal transmission delay compensation and high-frequency jitter suppression, satisfying basic synchronous timing requirements of medium-scale digital systems
4. Bộ thu phát nối tiếp tốc độ cao
- 16 GTY differential high-speed transceivers
Each lane supports a maximum transmission rate of 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard PCIe and Ethernet controllers shorten the development cycle of high-speed data interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 520
Multiple I/O bank voltage domains ranging from 1.2V to 3.3V are available, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended and differential signal standards
The embedded system monitoring module continuously monitors chip junction temperature, internal power supply voltages and external analog input signals in real time
Đặc tính của bộ nguồn
Core operating voltage for Speed Grade 1 ranges from 0.825V to 0.876V. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into mutually independent power domains, supporting partial module power gating to dynamically reduce overall power consumption
Typical total power consumption ranges from 7W to 28W. For stable full-load continuous operation at the upper industrial temperature limit, forced air cooling is required
Thông số kỹ thuật về đóng gói và lắp ráp SMT
- Package form: 1517-pin FCBGA flip-chip ball grid array
- Mức độ nhạy cảm với độ ẩm: MSL4. Tất cả các công đoạn hàn nóng chảy phải được hoàn thành trong vòng 72 giờ sau khi mở bao bì chân không
- Thiết kế bao bì không chứa chì, hoàn toàn tuân thủ các tiêu chuẩn môi trường RoHS
- Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly production
Khả năng thích ứng với môi trường và độ tin cậy trong vận hành
The chip maintains long-term stable operation under drastic temperature fluctuations, mechanical shock, vibration and intense electromagnetic interference harsh environments. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, with basic radiation tolerance reinforcement, applicable to miniature aerospace payload equipment, military portable measuring terminals and outdoor field industrial deployment scenarios
Các tình huống ứng dụng điển hình
- Lightweight UAV sensor data preprocessing boards and miniature airborne signal acquisition modules
- Small-sized rugged auxiliary control boards for military portable testing devices
- Handheld field spectrum analyzers and portable arbitrary waveform signal generators
- Outdoor multi-channel industrial sensor network data acquisition and real-time signal processing systems
- Small-scale algorithm verification platforms with strict power and volume constraints
- Vehicle-mounted intelligent sensing front-end preprocessing units and wide-temperature lightweight industrial edge gateways
