| MODEL P / N | SERI | JUMLAH LABORATORIUM/CLBS | TINGKAT KECEPATAN | JUMLAH ELEMEN / SEL LOGIKA | TOTAL BIT RAM | JUMLAH I / O | TEGANGAN - PASOKAN | JENIS PEMASANGAN | SUHU PENGOPERASIAN | PAKET / KASUS | PAKET PERANGKAT PEMASOK |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU3P-1FFVC1517I | XCVU3P | 49,26 | -1,00 | 862.050 LE | 25300000 | 560 | 0,85 V tipikal | SMD / SMM | 0°C~110°C | FBGA-1517 (1517 FCBGA) | 1517-FCBGA |
XCVU3P-1FFVC1517I
Produsen: Xilinx
Sel Logika: 3,780,000
Irisan Logika: 590,000
RAM tertanam (eRAM): 81.360 Kb (2.260 × 36 Kb Blok RAM)
I/O Pengguna Maksimum: 600
Paket: FFVC1517 (Flip-Chip BGA)
Tingkat Kecepatan: -1
Suhu Pengoperasian: Industri (-40°C hingga +100°C)
Spesifikasi
Definisi Nomor Bagian
This industrial-grade low-power FPGA belongs to AMD Xilinx Virtex UltraScale+ family, fabricated on advanced 16nm FinFET process. It adopts power-optimized UltraScale+ architecture with streamlined on-chip resources, tailored for battery-powered portable field test terminals, miniature unmanned aerial vehicle payload modules, outdoor industrial sensor acquisition equipment and vehicle-mounted embedded preprocessing units that require reliable continuous operation across the full industrial temperature range.
- XCVU3P: Entry-level power-optimized device of Virtex UltraScale+ lineup. The suffix P denotes power-focused optimization, delivering lower static power consumption and optimized internal routing latency compared with standard variants
- -1: Speed Grade 1, low-power prioritized timing specification. Thermal balance and power saving are core design targets rather than maximum operating clock frequency, perfectly suited for continuously operated hardware with limited heat dissipation space
- FFVC1517: 1517-ball compact flip-chip FCBGA package with physical dimension 40mm × 40mm. Compact outline realizes equipment miniaturization, while reserved pins support full layout of integrated GTY transceivers, general-purpose I/O wiring and DDR4 memory interface docking
- I: Industrial temperature rating, continuous junction temperature operating range: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 862050
- Configurable CLB Slices: 49260
- Total Flip-Flops: 985200
- Total LUT Lookup Tables: 492600
- Distributed RAM Capacity: 6.8 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E3 arithmetic blocks: 672 units, optimized for fixed-point and floating-point calculation, small-scale FFT spectrum analysis, sensor signal processing, lightweight cryptographic algorithm acceleration and small matrix computing tasks
- Total Block RAM Capacity: 14.76 Mb, utilized for image frame buffering, shallow FIFO data caching, waveform storage and algorithm parameter lookup tables
No UltraRAM memory is embedded inside this chip
3. Clock Management Subsystem
- 10 MMCM clock management tiles
- 10 PLL phase-locked loops
Multiple independent clock domains can be flexibly configured to achieve precise clock phase adjustment, signal transmission delay compensation and high-frequency jitter suppression, satisfying basic synchronous timing requirements of medium-scale digital systems
4. High-Speed Serial Transceivers
- 16 GTY differential high-speed transceivers
Each lane supports a maximum transmission rate of 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard PCIe and Ethernet controllers shorten the development cycle of high-speed data interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 520
Multiple I/O bank voltage domains ranging from 1.2V to 3.3V are available, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all conventional single-ended and differential signal standards
The embedded system monitoring module continuously monitors chip junction temperature, internal power supply voltages and external analog input signals in real time
Power Supply Characteristics
Core operating voltage for Speed Grade 1 ranges from 0.825V to 0.876V. Programmable logic fabric, block RAM, DSP arrays and serial transceivers are divided into mutually independent power domains, supporting partial module power gating to dynamically reduce overall power consumption
Typical total power consumption ranges from 7W to 28W. For stable full-load continuous operation at the upper industrial temperature limit, forced air cooling is required
Packaging and SMT Assembly Specifications
- Package form: 1517-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly production
Environmental Adaptability and Operational Reliability
The chip maintains long-term stable operation under drastic temperature fluctuations, mechanical shock, vibration and intense electromagnetic interference harsh environments. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, with basic radiation tolerance reinforcement, applicable to miniature aerospace payload equipment, military portable measuring terminals and outdoor field industrial deployment scenarios
Skenario Aplikasi Umum
- Lightweight UAV sensor data preprocessing boards and miniature airborne signal acquisition modules
- Small-sized rugged auxiliary control boards for military portable testing devices
- Handheld field spectrum analyzers and portable arbitrary waveform signal generators
- Outdoor multi-channel industrial sensor network data acquisition and real-time signal processing systems
- Small-scale algorithm verification platforms with strict power and volume constraints
- Vehicle-mounted intelligent sensing front-end preprocessing units and wide-temperature lightweight industrial edge gateways
