XCVU3P-1FFVC1517I

Manufacturer: Xilinx
Logic Cells: 3,780,000
Logic Slices: 590,000
Embedded RAM (eRAM): 81,360 Kb (2,260 × 36Kb Block RAM)
Maximum User I/O: 600
Package: FFVC1517 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XCVU3P-1FFVC1517IXCVU3P49,26-1,00862,050 LE253000005600.85 V typicalSMD/SMT0°C~110°CFBGA-1517 (1517 FCBGA)1517-FCBGA