XCVU13P-1FHGC2104I

Manufacturer: Xilinx
Logic Cells: 13,140,000
Logic Slices: 2,050,000
Embedded RAM (eRAM): 94,320 Kb (2,620 × 36Kb Block RAM)
Maximum User I/O: 800
Package: FHGC2104 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCVU13P-1FHGC2104I XCVU13P (Virtex US+) 216,00 -1,00 3,780,000 LE 514,867,200 bits 416 ~0.698–0.876 V Surface Mount (BGA) Industrial (−40°C to +100°C) 2104 FCBGA 2104-FCBGA (FBGA-2104) .