XCVU125-3FLVB2104E

Manufacturer: Xilinx
Logic Cells: 1,700,000
Logic Slices: 265,000
Embedded RAM (eRAM): 58,320 Kb (1,620 × 36Kb Block RAM)
Maximum User I/O: 700
Package: FLVB2104 (Flip-Chip BGA)
Speed Grade: -3
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCVU125-3FLVB2104E Virtex® UltraScale (XCVU125) 89,52 -3,00 1,566,600 LE 90,726,400 bits 832 ~0.922–0.979 V (speed grade dependent) Surface Mount 0°C ~ +100°C (TJ) FBGA-2104 / FCBGA-2104 2104-FCBGA