| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU125-3FLVB2104E | 버텍스® 울트라스케일(XCVU125) | 89,52 | -3,00 | 1,566,600 LE | 90,726,400비트 | 832 | ~0.922~0.979V(속도 등급에 따라 다름) | 표면 실장 | 0°C ~ +100°C(TJ) | FBGA-2104 / FCBGA-2104 | 2104-FCBGA |
사양
부품 번호 정의
This extended temperature high-performance FPGA belongs to Xilinx Virtex UltraScale family, manufactured on advanced 20nm FinFET process. It delivers balanced programmable logic, arithmetic computing, embedded memory and high-speed serial interface resources, designed for high-speed communication equipment, indoor chip prototype verification platforms, laboratory signal analysis instruments and stationary industrial computing devices that need stable operation within extended temperature range.
- XCVU125: Mid-capacity mainstream model of Virtex UltraScale series, equipped with complete high-speed interconnection architecture and well-matched overall resource configuration
- -3: Speed Grade 3, the highest performance timing grade of this product line. It supports maximum operating clock frequency, achieves excellent timing closure efficiency for high-frequency complex digital designs, and adapts to high-throughput computing scenarios with strict timing requirements
- FLVB2104: 2104-ball compact flip-chip FCBGA package. Moderate package size facilitates equipment miniaturization, while sufficient pins support full layout of all on-chip transceivers, parallel signal wiring and multi-channel memory interface connection
- E: Extended commercial temperature grade, junction temperature continuous operating range: 0°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total System Logic Cells: 1567000
- Configurable CLB Slices: 89520
- Total Flip-Flops: 1790400
- Total LUT Lookup Tables: 895200
- Distributed RAM Capacity: 11.8 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E2 arithmetic computing blocks: 1200 units, capable of fixed-point and floating-point calculation, large-scale FFT spectrum analysis, communication baseband modulation and demodulation, cryptographic algorithm acceleration and medium matrix operation tasks
- Total Block RAM Capacity: 44.3 Mb, applied for image frame buffering, deep FIFO data caching, waveform storage and algorithm parameter lookup tables
No embedded UltraRAM inside this device
3. Clock Management Subsystem
- 14 MMCM clock management tiles
- 14 PLL phase-locked loops
Multiple mutually independent clock domains can be flexibly configured, supporting clock phase fine adjustment, signal transmission delay compensation and high-frequency jitter suppression, which fully meets strict synchronous timing demands of complex large-scale digital systems
4. 고속 직렬 트랜시버
- 28 channels of GTH differential high-speed transceivers
Each lane supports a maximum transmission rate of 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. Built-in hard 100G Ethernet MAC blocks greatly simplify high-bandwidth network interface development
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 928
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all commonly used single-ended and differential signal standards
The embedded system monitoring module continuously collects real-time data of chip junction temperature, internal power supply voltages and external analog input signals
Power Supply Characteristics
Nominal core operating voltage for -3 high-speed grade ranges from 0.87V to 0.93V. Logic fabric, block RAM, DSP arrays and serial transceivers adopt isolated independent power domains, supporting partial module power shutdown for flexible power management
Typical total power consumption ranges from 18W to 49W. For continuous stable full-load operation under the upper temperature limit, forced air cooling is required
Packaging and SMT Assembly Specifications
- Package form: 2104-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be completed within 72 hours after vacuum packaging is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB assembly
Environmental Adaptability and Reliability
The chip is customized for indoor constant-temperature working environments, capable of long-term stable operation under mild temperature fluctuation, slight mechanical vibration and conventional electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, without anti-radiation reinforcement design, and cannot adapt to outdoor low-temperature and severe rugged working conditions
일반적인 애플리케이션 시나리오
- Medium-scale ASIC and SoC hardware prototype verification platforms, digital logic emulation equipment deployed in laboratories
- 100G optical communication line cards, data center network switching and routing processing boards
- Desktop ultra-wideband spectrum analyzers, multi-channel arbitrary waveform generators and high-speed data acquisition instruments
- Indoor industrial machine vision real-time detection and image processing main control units
- High-speed signal algorithm research and development platforms for universities and research institutes
- High-bandwidth data interconnection gateway and industrial encryption acceleration hardware
