XC7Z035-3FFG900E

Manufacturer: AMD / Xilinx
Logic Cells: 276,480
Logic Slices: 43,200
Embedded RAM (eRAM): 17,664 Kb (984 × 18Kb Block RAM)
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z035-3FFG900E Zynq-7000 0,00 -3,00 0