| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX70T-2FF1136C | Virtex-5 FXT | 5.600,00 | -2,00 | 71680 | 5455872 | 640 | 0,95 V-1,05 V | Oberflächenmontage | 0 °C ~ +85 °C | 1136-FBGA / FCBGA | 1136-FCBGA (≈31×31 mm) |
XC5VFX70T-2FF1136C
Hersteller: Xilinx
Logische Zellen: 71,680
Logische Schnitte: ~5,600
Eingebettetes RAM (eRAM): 5,456 Kb
Paket: FF1136 (Fine?Pitch BGA)
Betriebstemperatur: Handelsüblich (0°C bis +85°C)
Spezifikationen
Die XC5VFX70T-2FF1136C is a solid Virtex-5 FXT FPGA from Xilinx (now AMD), built on a reliable 65nm process. It’s a great choice when you need serious high-speed serial connectivity combined with plenty of programmable logic.
Here’s the quick rundown of what you’re getting:
~71,680 logic cells — gives you good headroom for medium-to-large designs
16× RocketIO GTX transceivers — capable of multi-gigabit rates (commonly used up to ~6.5 Gbps in many applications)
640 user I/Os — plenty of flexible pins for interfacing
Large block RAM (~5.4 Mbit embedded + distributed)
Integrated PowerPC 440 processor blocks — handy if your project needs embedded processing without an external CPU
Paket: 1136-pin FCBGA (35×35 mm), commercial temp range (0–85°C junction)
If you’re evaluating or qualifying replacements, check the latest AMD migration guides, but this chip remains a capable workhorse in many production systems.
