| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX70T-2FF1136C | Virtex-5 FXT | 5.600,00 | -2,00 | 71680 | 5455872 | 640 | 0,95 V-1,05 V | Montaje en superficie | 0 °C ~ +85 °C | 1136-FBGA / FCBGA | 1136-FCBGA (≈31 × 31 mm) |
XC5VFX70T-2FF1136C
Fabricante: Xilinx
Células lógicas: 71,680
Rebanadas lógicas: ~5,600
RAM integrada (eRAM): 5,456 Kb
Paquete: FF1136 (BGA de paso fino)
Temperatura de funcionamiento: Comercial (0°C a +85°C)
Especificaciones
En XC5VFX70T-2FF1136C is a solid Virtex-5 FXT FPGA from Xilinx (now AMD), built on a reliable 65nm process. It’s a great choice when you need serious high-speed serial connectivity combined with plenty of programmable logic.
Here’s the quick rundown of what you’re getting:
~71,680 logic cells — gives you good headroom for medium-to-large designs
16× RocketIO GTX transceivers — capable of multi-gigabit rates (commonly used up to ~6.5 Gbps in many applications)
640 E/S de usuario — plenty of flexible pins for interfacing
Large block RAM (~5.4 Mbit embedded + distributed)
Integrated PowerPC 440 processor blocks — handy if your project needs embedded processing without an external CPU
Paquete: 1136-pin FCBGA (35×35 mm), commercial temp range (0–85°C junction)
If you’re evaluating or qualifying replacements, check the latest AMD migration guides, but this chip remains a capable workhorse in many production systems.
