XC4VLX100-11FFG1148I

Hersteller: Xilinx
Logische Zellen: 110,592
Logische Schnitte: 49,152
Eingebettetes RAM (eRAM): 4.320 Kb (240 × 18Kb Block RAM)
Paket: FFG1148 (Flip?Chip BGA)
Betriebstemperatur: Industriell (-40°C bis +100°C)

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    Spezifikationen

    MODELL P/N SERIE ANZAHL DER LABORE/KLINIKEN GESCHWINDIGKEITSSTUFE ANZAHL DER LOGIKELEMENTE / ZELLEN RAM-BITS INSGESAMT ANZAHL DER E/A SPANNUNG - VERSORGUNG BEFESTIGUNGSTYP BETRIEBSTEMPERATUR VERPACKUNG / KASSE LIEFERANT GERÄTEPAKET
    XC4VLX100-11FFG1148I Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1,14 V ~ 1,26 V Oberflächenmontage -40 °C ~ +100 °C (industriell) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-11FFG1148I: The High-Speed Industrial Benchmark for Large-Scale Logic

    Die XC4VLX100-11FFG1148I is a high-performance, industrial-grade FPGA designed for mission-critical systems that demand both massive logic density and uncompromising timing precision. Built on Xilinx’s proven 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device offers 110.592 Logik-Zellen binned for the premium -11 Geschwindigkeitsstufe.

    Engineered for Industrial-grade (-40°C to +100°C) operation, this FPGA is the definitive choice for architects who need to maintain 300MHz+ internal clock frequencies in environments where thermal fluctuations and long-term reliability are non-negotiable.

    Kerntechnische Highlights

    • Peak -11 Speed Grade: The -11 grade provides significantly faster switching and reduced propagation delays compared to standard models. This extra timing headroom is critical for complex, high-utilization RTL designs where setup-and-hold closure is often the primary bottleneck.

    • Industrial Temperature Resilience: Rated for -40°C to +100°C junction temperature. This ensures that timing models remain valid even in high-heat industrial enclosures or unconditioned outdoor telecommunications cabinets.

    • High-Bandwidth I/O Management: Die FFG1148 package bricht aus 768 Benutzer-E/As. Supporting Xilinx’s SelectIO™ technology, it facilitates clean, high-speed interfacing with multiple DDR2/QDR-II memory banks and high-width parallel system buses.

    • Integrated XtremeDSP™ Blocks: Ausgestattet mit 96 DSP48-Scheiben. These dedicated hardware multipliers and accumulators allow for intensive arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric—essential for real-time filtering and sensor fusion.

    • High-Density Memory Hierarchy: Eigenschaften 4,320 Kb of Block RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput stream processing and localized data caching.


    Matrix der technischen Spezifikationen

    Merkmal Spezifikation
    Logische Zellen 110,592
    Konfigurierbare Logikblöcke (CLBs) 12,480
    Block-RAM insgesamt 4.320 Kb
    DSP48-Scheiben 96
    Maximale Benutzer-E/A 768
    Geschwindigkeitsstufe -11 (Premium High-Performance)
    Temperatur Grad Industriell (-40°C bis +100°C)
    Paket FFG1148 (Lead-Free Flip-Chip BGA)

    Why Specify the LX100-11I?

    1. Predictable Reliability in Saturated Designs

    When logic utilization pushes past 80%, routing congestion usually kills timing. The combination of the ASMBL architecture und die -11 Geschwindigkeitsstufe mitigates this “congestion penalty,” ensuring that your critical paths meet their frequency targets even when the chip is nearly full.

    2. Superior Signal Integrity

    Die FFG1148 Flip-Chip package is designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Gleichzeitiges Umschaltrauschen (SSN), providing the clean signal integrity required for robust, high-speed differential and single-ended signaling.

    3. Long-Lifecycle Product Stability

    The Virtex-4 series is a cornerstone of high-reliability industries. For projects requiring a 10-15 year service life—such as power grid monitoring, aerospace ground equipment, or medical imaging backplanes—the LX100-11I offers a proven track record and a well-documented toolchain.


    Anwendungen

    • Industrial Automation: High-precision robotics, motion control hubs, and multi-axis synchronizers.

    • Telekommunikation: Outdoor base station signal processing and protocol conversion.

    • Verteidigung und Luft- und Raumfahrt: Ground support systems and secure communication bridges.

    • Medizinische Systeme: Real-time data acquisition and reconstruction backends for CT/MRI scanners.