XC4VLX100-11FFG1148I

제조업체: 자일링스
로직 셀: 110,592
로직 슬라이스: 49,152
임베디드 RAM(eRAM): 4,320Kb(240 × 18Kb 블록 RAM)
패키지: FFG1148(플립?칩 BGA)
작동 온도: 산업용(-40°C ~ +100°C)

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    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC4VLX100-11FFG1148I Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1.14V ~ 1.26V 표면 실장 -40°C ~ +100°C(산업용) 1148-BBGA(FCBGA) 1148-FCBGA

    XC4VLX100-11FFG1148I: The High-Speed Industrial Benchmark for Large-Scale Logic

    그리고 XC4VLX100-11FFG1148I is a high-performance, industrial-grade FPGA designed for mission-critical systems that demand both massive logic density and uncompromising timing precision. Built on Xilinx’s proven 90nm ASMBL™(고급 실리콘 모듈형 블록) architecture, this device offers 110,592 로직 셀 binned for the premium -11 속도 등급.

    Engineered for 산업 등급(-40°C ~ +100°C) operation, this FPGA is the definitive choice for architects who need to maintain 300MHz+ internal clock frequencies in environments where thermal fluctuations and long-term reliability are non-negotiable.

    핵심 엔지니어링 하이라이트

    • Peak -11 Speed Grade: The -11 grade provides significantly faster switching and reduced propagation delays compared to standard models. This extra timing headroom is critical for complex, high-utilization RTL designs where setup-and-hold closure is often the primary bottleneck.

    • Industrial Temperature Resilience: 평가 대상 -40°C to +100°C junction temperature. This ensures that timing models remain valid even in high-heat industrial enclosures or unconditioned outdoor telecommunications cabinets.

    • High-Bandwidth I/O Management: 그리고 FFG1148 패키지 브레이크 아웃 768 사용자 I/O. Supporting Xilinx’s SelectIO™ 기술, it facilitates clean, high-speed interfacing with multiple DDR2/QDR-II memory banks and high-width parallel system buses.

    • Integrated XtremeDSP™ Blocks: 다음을 갖추고 있습니다. 96개의 DSP48 슬라이스. These dedicated hardware multipliers and accumulators allow for intensive arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric—essential for real-time filtering and sensor fusion.

    • High-Density Memory Hierarchy: 특징 4,320Kb의 블록 RAM(BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput stream processing and localized data caching.


    기술 사양 매트릭스

    기능 사양
    논리 셀 110,592
    구성 가능한 로직 블록(CLB) 12,480
    총 블록 RAM 4,320 Kb
    DSP48 슬라이스 96
    최대 사용자 I/O 768
    속도 등급 -11 (Premium High-Performance)
    온도 등급 산업용(-40°C ~ +100°C)
    패키지 FFG1148 (Lead-Free Flip-Chip BGA)

    Why Specify the LX100-11I?

    1. Predictable Reliability in Saturated Designs

    When logic utilization pushes past 80%, routing congestion usually kills timing. The combination of the ASMBL architecture and the -11 속도 등급 mitigates this “congestion penalty,” ensuring that your critical paths meet their frequency targets even when the chip is nearly full.

    2. 뛰어난 신호 무결성

    그리고 FFG1148 플립칩 패키지 is designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress 동시 스위칭 노이즈(SSN), providing the clean signal integrity required for robust, high-speed differential and single-ended signaling.

    3. Long-Lifecycle Product Stability

    The Virtex-4 series is a cornerstone of high-reliability industries. For projects requiring a 10-15 year service life—such as power grid monitoring, aerospace ground equipment, or medical imaging backplanes—the LX100-11I offers a proven track record and a well-documented toolchain.


    애플리케이션

    • 산업 자동화: High-precision robotics, motion control hubs, and multi-axis synchronizers.

    • 통신: Outdoor base station signal processing and protocol conversion.

    • 방위 및 항공우주: 지상 지원 시스템 및 안전한 통신 교량.

    • 의료 시스템: Real-time data acquisition and reconstruction backends for CT/MRI scanners.