| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX100-11FFG1148I | Virtex-4 LX | 11.520,00 | -11,00 | 99840 | 4478976 | 768 | 1,14 V ~ 1,26 V | Yüzey Montajı | -40 °C ~ +100 °C (Endüstriyel) | 1148-BBGA (FCBGA) | 1148-FCBGA |
XC4VLX100-11FFG1148I: The High-Speed Industrial Benchmark for Large-Scale Logic
Bu XC4VLX100-11FFG1148I is a high-performance, industrial-grade FPGA designed for mission-critical systems that demand both massive logic density and uncompromising timing precision. Built on Xilinx’s proven 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) architecture, this device offers 110.592 Mantık Hücresi binned for the premium -11 hız derecesi.
Engineered for Endüstriyel sınıf (-40 °C ila +100 °C) operation, this FPGA is the definitive choice for architects who need to maintain 300MHz+ internal clock frequencies in environments where thermal fluctuations and long-term reliability are non-negotiable.
Temel Mühendislikte Öne Çıkanlar
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Peak -11 Speed Grade: The -11 grade provides significantly faster switching and reduced propagation delays compared to standard models. This extra timing headroom is critical for complex, high-utilization RTL designs where setup-and-hold closure is often the primary bottleneck.
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Industrial Temperature Resilience: Şunlar için derecelendirilmiştir -40°C to +100°C junction temperature. This ensures that timing models remain valid even in high-heat industrial enclosures or unconditioned outdoor telecommunications cabinets.
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High-Bandwidth I/O Management: Bu FFG1148 paketi patlak veriyor 768 Kullanıcı I/O'ları. Supporting Xilinx’s SelectIO™ teknolojisi, it facilitates clean, high-speed interfacing with multiple DDR2/QDR-II memory banks and high-width parallel system buses.
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Integrated XtremeDSP™ Blocks: İle donatılmıştır 96 DSP48 dilimi. These dedicated hardware multipliers and accumulators allow for intensive arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric—essential for real-time filtering and sensor fusion.
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High-Density Memory Hierarchy: Özellikler 4.320 Kb Blok RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput stream processing and localized data caching.
Teknik Özellikler Matrisi
| Özellik | Şartname |
| Mantık Hücreleri | 110,592 |
| Yapılandırılabilir Mantık Blokları (CLB'ler) | 12,480 |
| Toplam Blok RAM | 4,320 Kb |
| DSP48 Dilimleri | 96 |
| Maksimum Kullanıcı G/Ç | 768 |
| Hız Sınıfı | -11 (Premium High-Performance) |
| Sıcaklık Sınıfı | Endüstriyel (-40°C ila +100°C) |
| Paket | FFG1148 (Kurşunsuz Flip-Chip BGA) |
Neden LX100-11I'yi Seçmelisiniz?
1. Predictable Reliability in Saturated Designs
When logic utilization pushes past 80%, routing congestion usually kills timing. The combination of the ASMBL mimarisi ve -11 hız derecesi mitigates this “congestion penalty,” ensuring that your critical paths meet their frequency targets even when the chip is nearly full.
2. Üstün Sinyal Bütünlüğü
Bu FFG1148 Flip-Chip paketi is designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Eşzamanlı Anahtarlama Gürültüsü (SSN), providing the clean signal integrity required for robust, high-speed differential and single-ended signaling.
3. Long-Lifecycle Product Stability
The Virtex-4 series is a cornerstone of high-reliability industries. For projects requiring a 10-15 year service life—such as power grid monitoring, aerospace ground equipment, or medical imaging backplanes—the LX100-11I offers a proven track record and a well-documented toolchain.
Uygulamalar
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Endüstriyel Otomasyon: High-precision robotics, motion control hubs, and multi-axis synchronizers.
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Telekomünikasyon: Outdoor base station signal processing and protocol conversion.
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Savunma ve Havacılık: Yer destek sistemleri ve güvenli iletişim köprüleri.
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Tıbbi Sistemler: Real-time data acquisition and reconstruction backends for CT/MRI scanners.







