XC4VLX100-11FFG1148I

Produsen: Xilinx
Sel Logika: 110,592
Irisan Logika: 49,152
RAM tertanam (eRAM): 4.320 Kb (240 × 18Kb Blok RAM)
Paket: FFG1148 (Flip? Chip BGA)
Suhu Pengoperasian: Industri (-40°C hingga +100°C)

KIRIMKAN PESAN KEPADA KAMI

    Spesifikasi

    MODEL P / N SERI JUMLAH LABORATORIUM/CLBS TINGKAT KECEPATAN JUMLAH ELEMEN / SEL LOGIKA TOTAL BIT RAM JUMLAH I / O TEGANGAN - PASOKAN JENIS PEMASANGAN SUHU PENGOPERASIAN PAKET / KASUS PAKET PERANGKAT PEMASOK
    XC4VLX100-11FFG1148I Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1,14 V ~ 1,26 V Pemasangan di Permukaan -40 ° C ~ +100 ° C (Industri) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-11FFG1148I: The High-Speed Industrial Benchmark for Large-Scale Logic

    The XC4VLX100-11FFG1148I is a high-performance, industrial-grade FPGA designed for mission-critical systems that demand both massive logic density and uncompromising timing precision. Built on Xilinx’s proven 90nm ASMBL™ (Blok Modular Silikon Tingkat Lanjut) architecture, this device offers 110,592 Logic Cells binned for the premium -11 tingkat kecepatan.

    Engineered for Industrial-grade (-40°C to +100°C) operation, this FPGA is the definitive choice for architects who need to maintain 300MHz+ internal clock frequencies in environments where thermal fluctuations and long-term reliability are non-negotiable.

    Sorotan Rekayasa Inti

    • Peak -11 Speed Grade: The -11 grade provides significantly faster switching and reduced propagation delays compared to standard models. This extra timing headroom is critical for complex, high-utilization RTL designs where setup-and-hold closure is often the primary bottleneck.

    • Industrial Temperature Resilience: Rated for -40°C to +100°C junction temperature. This ensures that timing models remain valid even in high-heat industrial enclosures or unconditioned outdoor telecommunications cabinets.

    • High-Bandwidth I/O Management: The Paket FFG1148 pecah 768 I/O Pengguna. Supporting Xilinx’s SelectIO™ technology, it facilitates clean, high-speed interfacing with multiple DDR2/QDR-II memory banks and high-width parallel system buses.

    • Integrated XtremeDSP™ Blocks: Equipped with 96 irisan DSP48. These dedicated hardware multipliers and accumulators allow for intensive arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric—essential for real-time filtering and sensor fusion.

    • High-Density Memory Hierarchy: Fitur 4.320 Kb RAM Blok (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput stream processing and localized data caching.


    Matriks Spesifikasi Teknis

    Fitur Spesifikasi
    Sel Logika 110,592
    Blok Logika yang Dapat Dikonfigurasi (CLB) 12,480
    Total Blok RAM 4.320 Kb
    Irisan DSP48 96
    I/O Pengguna Maksimum 768
    Tingkat Kecepatan -11 (Premium High-Performance)
    Tingkat Suhu Industri (-40°C hingga +100°C)
    Paket FFG1148 (BGA Flip-Chip Bebas Timbal)

    Why Specify the LX100-11I?

    1. Predictable Reliability in Saturated Designs

    When logic utilization pushes past 80%, routing congestion usually kills timing. The combination of the ASMBL architecture and the -11 tingkat kecepatan mitigates this “congestion penalty,” ensuring that your critical paths meet their frequency targets even when the chip is nearly full.

    2. Integritas Sinyal yang Unggul

    The FFG1148 Flip-Chip package is designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Kebisingan Peralihan Serentak (SSN), providing the clean signal integrity required for robust, high-speed differential and single-ended signaling.

    3. Long-Lifecycle Product Stability

    The Virtex-4 series is a cornerstone of high-reliability industries. For projects requiring a 10-15 year service life—such as power grid monitoring, aerospace ground equipment, or medical imaging backplanes—the LX100-11I offers a proven track record and a well-documented toolchain.


    Aplikasi

    • Otomasi Industri: High-precision robotics, motion control hubs, and multi-axis synchronizers.

    • Telekomunikasi: Outdoor base station signal processing and protocol conversion.

    • Defense & Aerospace: Ground support systems and secure communication bridges.

    • Sistem Medis: Real-time data acquisition and reconstruction backends for CT/MRI scanners.