| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX100-11FFG1148I | Virtex-4 LX | 11.520,00 | -11,00 | 99840 | 4478976 | 768 | 1,14 V ~ 1,26 V | Oberflächenmontage | -40 °C ~ +100 °C (Industrial) | 1148-BBGA (FCBGA) | 1148-FCBGA |
XC4VLX100-11FFG1148I: The High-Speed Industrial Benchmark for Large-Scale Logic
Die XC4VLX100-11FFG1148I is a high-performance, industrial-grade FPGA designed for mission-critical systems that demand both massive logic density and uncompromising timing precision. Built on Xilinx’s proven 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device offers 110,592 Logic Cells binned for the premium -11 speed grade.
Engineered for Industrial-grade (-40°C to +100°C) operation, this FPGA is the definitive choice for architects who need to maintain 300MHz+ internal clock frequencies in environments where thermal fluctuations and long-term reliability are non-negotiable.
Core Engineering Highlights
Peak -11 Speed Grade: The -11 grade provides significantly faster switching and reduced propagation delays compared to standard models. This extra timing headroom is critical for complex, high-utilization RTL designs where setup-and-hold closure is often the primary bottleneck.
Industrial Temperature Resilience: Rated for -40°C to +100°C junction temperature. This ensures that timing models remain valid even in high-heat industrial enclosures or unconditioned outdoor telecommunications cabinets.
High-Bandwidth I/O Management: Die FFG1148 package breaks out 768 User I/Os. Supporting Xilinx’s SelectIO™ technology, it facilitates clean, high-speed interfacing with multiple DDR2/QDR-II memory banks and high-width parallel system buses.
Integrated XtremeDSP™ Blocks: Equipped with 96 DSP48 slices. These dedicated hardware multipliers and accumulators allow for intensive arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric—essential for real-time filtering and sensor fusion.
High-Density Memory Hierarchy: Eigenschaften 4,320 Kb of Block RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput stream processing and localized data caching.
Technical Specification Matrix
| Merkmal | Spezifikation |
| Logische Zellen | 110,592 |
| Configurable Logic Blocks (CLBs) | 12,480 |
| Total Block RAM | 4.320 Kb |
| DSP48 Slices | 96 |
| Maximum User I/O | 768 |
| Geschwindigkeitsstufe | -11 (Premium High-Performance) |
| Temperature Grade | Industriell (-40°C bis +100°C) |
| Paket | FFG1148 (Lead-Free Flip-Chip BGA) |
Why Specify the LX100-11I?
1. Predictable Reliability in Saturated Designs
When logic utilization pushes past 80%, routing congestion usually kills timing. The combination of the ASMBL architecture and the -11 speed grade mitigates this “congestion penalty,” ensuring that your critical paths meet their frequency targets even when the chip is nearly full.
2. Superior Signal Integrity
Die FFG1148 Flip-Chip package is designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Simultaneous Switching Noise (SSN), providing the clean signal integrity required for robust, high-speed differential and single-ended signaling.
3. Long-Lifecycle Product Stability
The Virtex-4 series is a cornerstone of high-reliability industries. For projects requiring a 10-15 year service life—such as power grid monitoring, aerospace ground equipment, or medical imaging backplanes—the LX100-11I offers a proven track record and a well-documented toolchain.
Anwendungen
Industrial Automation: High-precision robotics, motion control hubs, and multi-axis synchronizers.
Telecommunications: Outdoor base station signal processing and protocol conversion.
Defense & Aerospace: Ground support systems and secure communication bridges.
Medical Systems: Real-time data acquisition and reconstruction backends for CT/MRI scanners.
