XC4VLX100-11FF1148C

Hersteller: Xilinx
Logische Zellen: 110,592
Logische Schnitte: 49,152 (approx)
Eingebettetes RAM (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
Paket: FFG1148 (Flip-Chip BGA)
Betriebstemperatur: Handelsüblich (0°C bis +85°C)

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    Spezifikationen

    MODELL P/N SERIE ANZAHL DER LABORE/KLINIKEN GESCHWINDIGKEITSSTUFE ANZAHL DER LOGIKELEMENTE / ZELLEN RAM-BITS INSGESAMT ANZAHL DER E/A SPANNUNG - VERSORGUNG BEFESTIGUNGSTYP BETRIEBSTEMPERATUR VERPACKUNG / KASSE LIEFERANT GERÄTEPAKET
    XC4VLX100-11FF1148C Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1,14 V ~ 1,26 V Oberflächenmontage 0 °C ~ +85 °C (handelsüblich) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-11FF1148C: High-Speed Logic Integration for Premium Commercial Systems

    Die XC4VLX100-11FF1148C represents the high-performance tier of the Virtex®-4 LX family, specifically binned for the -11 Geschwindigkeitsstufe. Built on Xilinx’s advanced 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this FPGA is designed for architects who require a massive logic fabric—110,592 Logic Cells—combined with the tighter timing margins necessary for high-frequency data processing.

    Housed in the FF1148 Flip-Chip BGA package, it provides an exceptional balance of logic density, high-speed clocking, and robust I/O throughput for commercial-grade applications (0°C to +85°C).

    Core Engineering Highlights

    • Fastest Logic Fabric (-11 Speed Grade): The -11 grade offers significantly reduced propagation delays compared to the standard -10 models. This provides the critical timing headroom required for 300MHz+ internal bus speeds and complex, multi-level logic paths.

    • High-Density Resource Array: Mit 110,592 Logic Cells und 4,320 Kb of Block RAM, the LX100 provides ample space for consolidating multiple IP cores, deep FIFO buffers, and sophisticated custom RTL without routing saturation.

    • Advanced SelectIO™ Capability: Die FF1148 package exposes 768 Benutzer-E/As, supporting a wide range of differential and single-ended signaling standards. The Flip-Chip design minimizes lead inductance, ensuring superior signal integrity for high-speed memory interfaces like DDR2 and QDR-II.

    • XtremeDSP™ Performance: Eigenschaften 96 dedicated DSP48 slices. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, making the device highly effective for real-time video processing and digital filtering.

    • Clocking Precision: Integriert Digitale Taktverwalter (DCMs) provide sub-nanosecond skew control and frequency synthesis, ensuring global synchronization across massive, multi-clock domain designs.


    Technical Specification Matrix

    Merkmal Spezifikation
    Logische Zellen 110,592
    Configurable Logic Blocks (CLBs) 12,480
    Block-RAM insgesamt 4.320 Kb
    DSP48-Scheiben 96
    Maximum User I/O 768
    Geschwindigkeitsstufe -11 (Hochleistung)
    Temperatur Grad Handelsüblich (0°C bis +85°C)
    Paket Typ FF1148 (Flip-Chip BGA)

    Hardware Architect’s Perspective: Why Specify the LX100-11C?

    1. Faster Timing Closure

    In high-utilization designs, routing congestion often eats into the timing budget. Choosing the -11 Geschwindigkeitsstufe provides the necessary setup-and-hold slack to achieve timing closure more efficiently, reducing development cycles and ensuring “right-the-first-time” silicon behavior.

    2. Signal Integrity at Scale

    Driving nearly 800 I/Os simultaneously requires an exceptionally clean power distribution network. The FF1148 package is engineered with an extensive array of power and ground pins to mitigate Simultaneous Switching Noise (SSN), which is critical for maintaining robust noise margins in high-speed parallel architectures.

    3. Mature Toolchain & Field Reliability

    The Virtex-4 LX100 is a time-tested platform. For commercial systems with long lifecycles—such as medical imaging backplanes, professional broadcasting gear, or high-end instrumentation—the stability of the 90nm process and its well-documented errata offer a low-risk path to production.


    Primary Applications

    • Professional Video: 4K format conversion, real-time encoding, and high-end switching.

    • Medical Systems: Advanced MRI/CT data acquisition and reconstruction backends.

    • Prüfung und Messung: Hochgeschwindigkeits-Logik-Analysatoren und automatische Testgeräte (ATE).

    • Communications: Protocol bridging and localized high-speed switching fabrics.