XC4VLX100-11FF1148C

Производитель: Xilinx
Логические ячейки: 110,592
Логические срезы: 49,152 (approx)
Встроенная оперативная память (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
Упаковка: FFG1148 (Flip-Chip BGA)
Рабочая температура: Коммерческий (от 0°C до +85°C)

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/Н СЕРИИ КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ УРОВЕНЬ СКОРОСТИ КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК ВСЕГО БИТОВ ОЗУ КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ НАПРЯЖЕНИЕ - ПИТАНИЕ ТИП КРЕПЛЕНИЯ РАБОЧАЯ ТЕМПЕРАТУРА УПАКОВКА / КЕЙС УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    XC4VLX100-11FF1148C Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1,14 V ~ 1,26 V Монтаж на поверхность 0 °C ~ +85 °C (коммерческий) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-11FF1148C: High-Speed Logic Integration for Premium Commercial Systems

    Сайт XC4VLX100-11FF1148C represents the high-performance tier of the Virtex®-4 LX family, specifically binned for the -11 класс скорости. Built on Xilinx’s advanced 90 нм ASMBL™ (усовершенствованный кремниевый модульный блок) architecture, this FPGA is designed for architects who require a massive logic fabric—110,592 Logic Cells—combined with the tighter timing margins necessary for high-frequency data processing.

    Размещается в FF1148 Flip-Chip BGA package, it provides an exceptional balance of logic density, high-speed clocking, and robust I/O throughput for commercial-grade applications (0°C to +85°C).

    Core Engineering Highlights

    • Fastest Logic Fabric (-11 Speed Grade): The -11 grade offers significantly reduced propagation delays compared to the standard -10 models. This provides the critical timing headroom required for 300MHz+ internal bus speeds and complex, multi-level logic paths.

    • High-Density Resource Array: С 110,592 Logic Cells и 4,320 Kb of Block RAM, the LX100 provides ample space for consolidating multiple IP cores, deep FIFO buffers, and sophisticated custom RTL without routing saturation.

    • Advanced SelectIO™ Capability: Сайт FF1148 package exposes 768 User I/Os, supporting a wide range of differential and single-ended signaling standards. The Flip-Chip design minimizes lead inductance, ensuring superior signal integrity for high-speed memory interfaces like DDR2 and QDR-II.

    • XtremeDSP™ Performance: Характеристики 96 dedicated DSP48 slices. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, making the device highly effective for real-time video processing and digital filtering.

    • Clocking Precision: Интегрированный Digital Clock Managers (DCMs) provide sub-nanosecond skew control and frequency synthesis, ensuring global synchronization across massive, multi-clock domain designs.


    Матрица технических характеристик

    Характеристика Технические характеристики
    Логические ячейки 110,592
    Конфигурируемые логические блоки (CLB) 12,480
    Всего блоков оперативной памяти 4 320 Кб
    Ломтики DSP48 96
    Максимальный пользовательский ввод/вывод 768
    Степень скорости -11 (высокая производительность)
    Температурный класс Коммерческий (от 0°C до +85°C)
    Тип упаковки FF1148 (Flip-Chip BGA)

    Hardware Architect’s Perspective: Why Specify the LX100-11C?

    1. Faster Timing Closure

    In high-utilization designs, routing congestion often eats into the timing budget. Choosing the -11 класс скорости provides the necessary setup-and-hold slack to achieve timing closure more efficiently, reducing development cycles and ensuring “right-the-first-time” silicon behavior.

    2. Целостность сигнала при масштабировании

    Driving nearly 800 I/Os simultaneously requires an exceptionally clean power distribution network. The FF1148 package is engineered with an extensive array of power and ground pins to mitigate Simultaneous Switching Noise (SSN), which is critical for maintaining robust noise margins in high-speed parallel architectures.

    3. Mature Toolchain & Field Reliability

    The Virtex-4 LX100 is a time-tested platform. For commercial systems with long lifecycles—such as medical imaging backplanes, professional broadcasting gear, or high-end instrumentation—the stability of the 90nm process and its well-documented errata offer a low-risk path to production.


    Основные приложения

    • Professional Video: 4K format conversion, real-time encoding, and high-end switching.

    • Медицинские системы: Advanced MRI/CT data acquisition and reconstruction backends.

    • Test & Measurement: High-speed logic analyzers and automated test equipment (ATE).

    • Коммуникации: Protocol bridging and localized high-speed switching fabrics.