xc4vlx100-11ff111148c

الشركة المصنعة: زيلينكس
الخلايا المنطقية: 110,592
شرائح المنطق: 49,152 (approx)
ذاكرة الوصول العشوائي المدمجة (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
الحزمة: FFG1148 (Flip-Chip BGA)
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)

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    المواصفات

    الطراز P/N السلسلة عدد المعامل/المختبرات درجة السرعة عدد العناصر/الخلايا المنطقية إجمالي بتات ذاكرة الوصول العشوائي (RAM) عدد الإدخال/الإخراج الجهد - الإمداد نوع التركيب درجة حرارة التشغيل العبوة / العلبة حزمة جهاز المورد
    xc4vlx100-11ff111148c Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1.14 فولت ~ 1.26 فولت التركيب على السطح 0 درجة مئوية ~ +85 درجة مئوية (تجاري) 1148-BBGA (FCCBGA) 1148-FCBGA

    XC4VLX100-11FF1148C: High-Speed Logic Integration for Premium Commercial Systems

    إن xc4vlx100-11ff111148c represents the high-performance tier of the Virtex®-4 LX family, specifically binned for the -11 speed grade. Built on Xilinx’s advanced 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this FPGA is designed for architects who require a massive logic fabric—110,592 Logic Cells—combined with the tighter timing margins necessary for high-frequency data processing.

    Housed in the FF1148 Flip-Chip BGA package, it provides an exceptional balance of logic density, high-speed clocking, and robust I/O throughput for commercial-grade applications (0°C to +85°C).

    Core Engineering Highlights

    • Fastest Logic Fabric (-11 Speed Grade): The -11 grade offers significantly reduced propagation delays compared to the standard -10 models. This provides the critical timing headroom required for 300MHz+ internal bus speeds and complex, multi-level logic paths.

    • High-Density Resource Array: With 110,592 Logic Cells و 4,320 Kb of Block RAM, the LX100 provides ample space for consolidating multiple IP cores, deep FIFO buffers, and sophisticated custom RTL without routing saturation.

    • Advanced SelectIO™ Capability: إن FF1148 package exposes 768 User I/Os, supporting a wide range of differential and single-ended signaling standards. The Flip-Chip design minimizes lead inductance, ensuring superior signal integrity for high-speed memory interfaces like DDR2 and QDR-II.

    • XtremeDSP™ Performance: الميزات 96 dedicated DSP48 slices. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, making the device highly effective for real-time video processing and digital filtering.

    • Clocking Precision: Integrated Digital Clock Managers (DCMs) provide sub-nanosecond skew control and frequency synthesis, ensuring global synchronization across massive, multi-clock domain designs.


    Technical Specification Matrix

    الميزة المواصفات
    الخلايا المنطقية 110,592
    Configurable Logic Blocks (CLBs) 12,480
    Total Block RAM 4,320 Kb
    DSP48 Slices 96
    Maximum User I/O 768
    درجة السرعة -11 (High Performance)
    درجة الحرارة تجاري (0 درجة مئوية إلى +85 درجة مئوية)
    نوع الحزمة FF1148 (Flip-Chip BGA)

    Hardware Architect’s Perspective: Why Specify the LX100-11C?

    1. Faster Timing Closure

    In high-utilization designs, routing congestion often eats into the timing budget. Choosing the -11 speed grade provides the necessary setup-and-hold slack to achieve timing closure more efficiently, reducing development cycles and ensuring “right-the-first-time” silicon behavior.

    2. Signal Integrity at Scale

    Driving nearly 800 I/Os simultaneously requires an exceptionally clean power distribution network. The FF1148 package is engineered with an extensive array of power and ground pins to mitigate Simultaneous Switching Noise (SSN), which is critical for maintaining robust noise margins in high-speed parallel architectures.

    3. Mature Toolchain & Field Reliability

    The Virtex-4 LX100 is a time-tested platform. For commercial systems with long lifecycles—such as medical imaging backplanes, professional broadcasting gear, or high-end instrumentation—the stability of the 90nm process and its well-documented errata offer a low-risk path to production.


    Primary Applications

    • Professional Video: 4K format conversion, real-time encoding, and high-end switching.

    • Medical Systems: Advanced MRI/CT data acquisition and reconstruction backends.

    • Test & Measurement: High-speed logic analyzers and automated test equipment (ATE).

    • Communications: Protocol bridging and localized high-speed switching fabrics.