XC4VLX100-11FF1148C

Üretici firma: Xilinx
Mantık Hücreleri: 110,592
Mantık Dilimleri: 49,152 (yaklaşık)
Gömülü RAM (eRAM): 4.320 Kb (240 × 18Kb Blok RAM)
Paket: FFG1148 (Flip-Chip BGA)
Çalışma Sıcaklığı: Ticari (0°C ila +85°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC4VLX100-11FF1148C Virtex-4 LX 11.520,00 -11,00 99840 4478976 768 1,14 V ~ 1,26 V Yüzey Montajı 0 °C ~ +85 °C (Ticari) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-11FF1148C: High-Speed Logic Integration for Premium Commercial Systems

    Bu XC4VLX100-11FF1148C represents the high-performance tier of the Virtex®-4 LX family, specifically binned for the -11 hız derecesi. Built on Xilinx’s advanced 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) architecture, this FPGA is designed for architects who require a massive logic fabric—110.592 Mantık Hücresi—combined with the tighter timing margins necessary for high-frequency data processing.

    Evin içinde FF1148 Flip-Chip BGA package, it provides an exceptional balance of logic density, high-speed clocking, and robust I/O throughput for commercial-grade applications (0°C to +85°C).

    Temel Mühendislikte Öne Çıkanlar

    • En Hızlı Mantık Kumaşı (-11 Hız Derecesi): The -11 grade offers significantly reduced propagation delays compared to the standard -10 models. This provides the critical timing headroom required for 300MHz+ internal bus speeds and complex, multi-level logic paths.

    • High-Density Resource Array: ile 110.592 Mantık Hücresi ve 4.320 Kb Blok RAM, the LX100 provides ample space for consolidating multiple IP cores, deep FIFO buffers, and sophisticated custom RTL without routing saturation.

    • Gelişmiş SelectIO™ Özelliği: Bu FF1148 paketi ortaya çıkarır 768 Kullanıcı I/O'ları, supporting a wide range of differential and single-ended signaling standards. The Flip-Chip design minimizes lead inductance, ensuring superior signal integrity for high-speed memory interfaces like DDR2 and QDR-II.

    • XtremeDSP™ Performance: Özellikler 96 özel DSP48 dilimi. These hard-coded blocks facilitate high-speed 18×18 arithmetic and MAC operations, making the device highly effective for real-time video processing and digital filtering.

    • Clocking Precision: Entegre Digital Clock Managers (DCMs) provide sub-nanosecond skew control and frequency synthesis, ensuring global synchronization across massive, multi-clock domain designs.


    Teknik Özellikler Matrisi

    Özellik Şartname
    Mantık Hücreleri 110,592
    Yapılandırılabilir Mantık Blokları (CLB'ler) 12,480
    Toplam Blok RAM 4,320 Kb
    DSP48 Dilimleri 96
    Maksimum Kullanıcı G/Ç 768
    Hız Sınıfı -11 (Yüksek Performans)
    Sıcaklık Sınıfı Ticari (0°C ila +85°C)
    Paket Tipi FF1148 (Flip-Chip BGA)

    Hardware Architect’s Perspective: Why Specify the LX100-11C?

    1. Faster Timing Closure

    In high-utilization designs, routing congestion often eats into the timing budget. Choosing the -11 hız derecesi provides the necessary setup-and-hold slack to achieve timing closure more efficiently, reducing development cycles and ensuring “right-the-first-time” silicon behavior.

    2. Ölçekte Sinyal Bütünlüğü

    Driving nearly 800 I/Os simultaneously requires an exceptionally clean power distribution network. The FF1148 paketi is engineered with an extensive array of power and ground pins to mitigate Eşzamanlı Anahtarlama Gürültüsü (SSN), which is critical for maintaining robust noise margins in high-speed parallel architectures.

    3. Mature Toolchain & Field Reliability

    The Virtex-4 LX100 is a time-tested platform. For commercial systems with long lifecycles—such as medical imaging backplanes, professional broadcasting gear, or high-end instrumentation—the stability of the 90nm process and its well-documented errata offer a low-risk path to production.


    Birincil Uygulamalar

    • Profesyonel Video: 4K format conversion, real-time encoding, and high-end switching.

    • Tıbbi Sistemler: Advanced MRI/CT data acquisition and reconstruction backends.

    • Test ve Ölçüm: High-speed logic analyzers and automated test equipment (ATE).

    • İletişim: Protocol bridging and localized high-speed switching fabrics.