XCZU9EG-1FFVC900C

Manufacturer: Xilinx
Logic Cells: 600,000
Logic Slices: 93,000
Embedded RAM (eRAM): 34,560 Kb (960 × 36Kb Block RAM)
Maximum User I/O: 300
Package: FFVC900 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCZU9EG-1FFVC900C Zynq UltraScale+ MPSoC (EG) 34.260,00 -1,00 ~599,500 ~32.1 Mbit 204 VCCINT ≈ 0.85 V typ Surface Mount (FCBGA) 0 °C to +85 °C FCBGA-900 900-FCBGA