| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU9EG-1FFVC900C | Zynq UltraScale+ MPSoC(EG) | 34.260,00 | -1,00 | ~599,500 | ~32.1 Mbit | 204 | VCCINT ≈ 0.85V 통상 | 표면 실장(FCBGA) | 0°C ~ +85°C | FCBGA-900 | 900-FCBGA |
사양
부품 번호 정의
This is Zynq UltraScale+ MPSoC from AMD Xilinx, fabricated on 16nm FinFET process. It combines ARM processing subsystem and programmable FPGA logic fabric, no built-in RF analog converters, designed for embedded vision, multi-channel data acquisition and mid-range edge computing systems.
- XCZU9EG: Mid-tier general-purpose MPSoC within Zynq UltraScale+ series
- -1: Speed Grade 1, baseline timing specification for cost-oriented designs
- FFVC900: 900-ball flip-chip FCBGA package
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Processor Domain)
- Quad-core ARM Cortex-A53 application processors for Linux running, network protocol stacks and application tasks
- Dual-core lockstep ARM Cortex-R5F real-time cores for low-latency control, fault diagnosis and safety-critical tasks
- Integrated Mali-400 MP2 GPU for graphical interface rendering and lightweight graphics processing
- Dedicated hardware video codec engine supporting simultaneous multi-channel video encoding and decoding
- Comprehensive peripheral interfaces: Dual Gigabit Ethernet, USB 3.0, SD/eMMC, CAN, UART, SPI, I2C, GPIO
- On-chip security module realizing secure boot, 256-bit AES encryption and bitstream anti-tampering protection
2. Programmable Logic Fabric (PL: FPGA Domain)
- Total Logic Cells: 256,000
- DSP48E2 arithmetic slices: 1520 units, deployed for FFT operations, digital filtering, image preprocessing and matrix calculation acceleration
- Total Block RAM + UltraRAM capacity: 16.08 Mbit
- Multiple MMCM and PLL clock management tiles to implement clock multiplication, division, phase adjustment and jitter suppression for multi-clock domain systems
- Configurable I/O banks supporting LVCMOS, LVDS and all mainstream differential signal electrical standards
3. High-Speed Serial Transceivers
16 GTY high-speed differential serial lanes, maximum single-lane transmission rate up to 16.375 Gbps. Compatible with PCIe Gen3, 10G Ethernet, Aurora and other protocols for high-speed inter-chip and inter-board data transmission.
전원 공급 장치 사양
Independent isolated power domains are configured for processing system, programmable logic and high-speed transceivers. Typical core logic voltage is 0.85 V. Dynamic voltage and frequency scaling can be enabled to reduce power consumption under light load conditions.
Typical overall power consumption ranges from 12 W to 35 W, which can be cooled by heat sinks or forced air cooling.
포장 및 SMT 조립 요건
- Package type: 900-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be finished within 168 hours after vacuum packaging is unsealed
- Lead-free packaging, fully compliant with global RoHS environmental directives
- Delivered in anti-static trays for automated industrial PCB mass production
Environmental & Reliability Features
Only suitable for commercial indoor ambient environments, not applicable to extreme low-temperature industrial and outdoor scenarios.
It supports SEU radiation error correction, partial dynamic reconfiguration and dual R5F core redundant operation, satisfying reliability demands of industrial automation equipment, commercial vision devices and indoor edge computing nodes.
일반적인 애플리케이션 시나리오
- Medium-sized industrial automation controllers, multi-axis servo main control units and industrial edge gateways
- Multi-channel embedded machine vision platforms, automated production line defect inspection equipment
- Commercial intelligent surveillance edge computing nodes, multi-camera video processing terminals
- Multi-channel high-speed data acquisition cards, vibration and signal monitoring instruments
- Medical indoor diagnostic equipment main control and signal processing modules
- Custom embedded SOM core boards and high-speed PCIe data transmission accelerator boards
