XCZU9EG-1FFVC900C

Manufacturer: Xilinx
Logic Cells: 600,000
Logic Slices: 93,000
Embedded RAM (eRAM): 34,560 Kb (960 × 36Kb Block RAM)
Maximum User I/O: 300
Package: FFVC900 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XCZU9EG-1FFVC900CZynq UltraScale+ MPSoC (EG)34.260,00-1,00~599,500~32.1 Mbit204VCCINT ≈ 0.85 V typSurface Mount (FCBGA)0 °C to +85 °CFCBGA-900900-FCBGA