XCZU3EG-1SFVC784E

Manufacturer: Xilinx
Logic Cells: 154,000
Logic Slices: 24,000
Embedded RAM (eRAM): 7,560 Kb (210 × 36Kb Block RAM)
Maximum User I/O: 250
Package: SFVC784 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XCZU3EG-1SFVC784EZynq® UltraScale+™ MPSoC (EG)8,82-1,00~154K logic cells~7.6 Mbit00.85 VSurface-mount (FCBGA)0 °C – 100 °C (TJ)FCBGA-784784-FCBGA