| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCZU3EG-1SFVC784E | Zynq® UltraScale+™ MPSoC(EG) | 8,82 | -1,00 | ~154K 로직 셀 | ~7.6Mbit | 0 | 0.85 V | 표면 실장(FCBGA) | 0°C - 100°C(TJ) | FCBGA-784 | 784-FCBGA |
사양
Part Number Detailed Explanation
This is a mid-range cost-effective heterogeneous SoC FPGA from Xilinx Zynq UltraScale+ MPSoC family, built on advanced 16nm FinFET process. It integrates ARM multi-core application processors, real-time processing units and programmable logic fabric into a single chip, designed for embedded vision, industrial automation, intelligent edge gateway and portable rugged devices with low power demand and wide-temperature operation requirements.
- XCZU3EG: Zynq UltraScale+ MPSoC device model. Equipped with dual-core ARM Cortex-A53 application processors, dual-core Cortex-R5F real-time cores, Mali-400 MP2 GPU and moderate-scale programmable logic resources; EG stands for extended grade with balanced logic, I/O and power specifications
- -1: Speed Grade 1, optimized for low power consumption. It prioritizes power efficiency rather than peak operating frequency, suitable for battery-powered and thermal-constrained embedded systems
- SFVC784: 784-ball flip-chip ceramic enhanced plastic BGA package, compact dimension facilitates equipment miniaturization while reserving sufficient peripheral expansion pins
- E: Extended industrial temperature range, operating junction temperature: -40°C ~ +100°C
Integrated Hardware Architecture & On-Chip Resources
1. Processing System (PS) Side (ARM Processor Subsystem)
- Application Cores: Dual ARM Cortex-A53 64-bit processors
- Real-Time Cores: Dual ARM Cortex-R5F lockstep cores for safety-critical tasks
- Graphics Engine: Mali-400 MP2 embedded GPU
- On-Chip Memory: 256KB L2 cache, 64KB tightly coupled memory for R5 cores
- Built-In Peripherals: Gigabit Ethernet controllers, USB 3.0, SD/MMC, CAN, UART, SPI, I2C, PCIe 2.1 hard block
2. Programmable Logic (PL) Side FPGA Resources
- Total Logic Cells: 154,000
- Configurable CLB Slices: 24,060
- DSP48E2 Arithmetic Blocks: 720 units, used for FFT, digital filtering, image convolution, sensor signal processing and matrix calculation acceleration
- Block RAM Capacity: 9.21 Mb, applied for image frame buffering, data FIFO cache, waveform storage and algorithm parameter tables
- UltraRAM: No embedded UltraRAM inside this model
3. 클럭 관리 모듈
- 4 MMCM clock management tiles
- 4 PLL phase-locked loops
Supports independent clock domain configuration for PS and PL parts, clock delay compensation and high-frequency jitter suppression, meeting synchronous timing requirements of hybrid processor-logic systems
4. 고속 직렬 트랜시버
- 8 channels of GTH high-speed differential transceivers
Maximum line rate up to 10.25 Gbps per lane, compatible with PCIe, SATA, Aurora, DisplayPort, Gigabit Ethernet and other mainstream high-speed serial protocols
5. I/O Resources & System Monitoring
- Total configurable user I/O pins: 328
Multiple I/O bank voltage domains covering 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, fully supporting LVCMOS, LVDS, HSTL and mainstream differential signal standards
Integrated system monitoring module, real-time tracking of chip junction temperature, all internal power supply voltages and external analog input signals
Power Supply Characteristics
16nm advanced process greatly reduces static power consumption. PS and PL subsystems adopt independent power rails for flexible power management and partial power shutdown
Typical overall power consumption: 3W ~ 12W. Passive heat sink can satisfy most industrial continuous working scenarios; active cooling is only required under full-load high-temperature running conditions
Packaging & SMT Assembly Specifications
- Package Form: 784-ball FCBGA
- Moisture Sensitivity Level: MSL3; all reflow soldering work shall be completed within 168 hours after vacuum package opening
- Lead-free packaging, fully compliant with RoHS environmental standards
- Stored and shipped in anti-static trays to avoid electrostatic damage during PCB mass production
Environmental Adaptability & Functional Reliability
Stable long-term operation under drastic temperature changes, mechanical vibration, shock and moderate electromagnetic interference industrial environments. It supports bitstream encryption, partial dynamic reconfiguration, SEU error correction and functional safety mechanisms, suitable for long-term field deployment of rugged embedded devices
일반적인 애플리케이션 시나리오
- Compact industrial machine vision cameras, real-time image detection and recognition terminals
- Industrial edge computing gateways, multi-protocol field bus data converters
- Vehicular auxiliary computing units, onboard sensor data fusion processing modules
- Portable medical diagnostic equipment, battery-powered signal measuring instruments
- Unmanned aerial vehicle lightweight flight control and payload data processing boards
- Wide-temperature embedded development platforms for industrial intelligent control
