XCVU190-1FLGB2104I

Manufacturer: Xilinx
Logic Cells: 2,100,000
Logic Slices: 328,000
Embedded RAM (eRAM): 75,960 Kb (2,110 × 36Kb Block RAM)
Maximum User I/O: 850
Package: FLGB2104 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCVU190-1FLGB2104I Virtex® UltraScale (XCVU190) 134,28 -1,00 2,349,900 LE 150,937,600 bits (150.9 Mbit) 702 ~0.922–0.979 V (listed ranges) Surface Mount -40°C ~ +100°C (TJ) FBGA-2104 / FCBGA-2104 2104-FCBGA