| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU190-1FLGA2577I | Virtex® UltraScale | 134,28 | -1,00 | 2,349,900 LE | 150,937,600 bits | 448 | 0.922–0.979 V (many 2577 listings show this V range). | SMD / FBGA | -40°C ~ +100°C | FBGA-2577 (2577 FCBGA) | 2577-FCBGA (52.5×52.5) |
XCVU190-1FLGA2577I
Manufacturer: Xilinx
Logic Cells: 2,100,000
Logic Slices: 328,000
Embedded RAM (eRAM): 75,960 Kb (2,110 × 36Kb Block RAM)
Maximum User I/O: 900
Package: FLGA2577 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Industrial (-40°C to +100°C)
Specifications
Part Number Introduction
This is an industrial temperature FPGA from Xilinx Virtex UltraScale series, fabricated on 20nm FinFET process. It balances programmable logic, computing units, storage resources and high-speed serial ports, mainly applied to power-sensitive aerospace payload equipment, industrial high-speed signal processing systems and rugged embedded computing devices that need stable operation across wide temperature range.
- XCVU190: Mid-high capacity chip of Virtex UltraScale product line, equipped with complete high-speed interconnection architecture and abundant general resource allocation
- -1: Speed Grade 1, low-power optimized version. It takes power consumption control and thermal stability as the primary goal instead of pursuing the highest operating frequency, perfectly matching devices with limited heat dissipation space and long continuous working time
- FLGA2577: 2577-ball flip-chip FCBGA large package. Abundant pins support full layout of all on-chip transceivers, large-scale parallel signal access and docking of multi-channel high-speed memory interfaces
- I: Industrial temperature grade, junction temperature working range: -40°C ~ +100°C
On-chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total Logic Cells: 1938720
- Configurable CLB Slices: 110640
- Total Flip-Flops: 2212800
- Total LUTs: 1106400
2. Arithmetic and Memory Resources
- DSP48E2 arithmetic units: 1728 units, applicable to fixed-point and floating-point calculation, large-scale FFT operation, radar signal modulation and demodulation, encryption algorithm acceleration and medium and large matrix computing tasks
- Total Block RAM capacity: 53.2 Mb, used for large-capacity image frame cache, deep FIFO data buffer, waveform storage and algorithm parameter tables
- Distributed RAM capacity: 14.6 Mb, used for on-chip small temporary cache and lightweight asynchronous data interaction
3. Clock Management Subsystem
- 16 MMCM clock management tiles
- 16 PLL phase locked loops
Users can configure multiple independent clock domains flexibly, realize clock phase fine adjustment, signal delay compensation and high-frequency jitter suppression, which meets the strict timing synchronization requirements of complex large-scale digital systems
4. High-speed Serial Transceivers
- 32 GTH differential high-speed transceivers
The maximum transmission rate of each single lane reaches 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. The built-in hard Ethernet IP simplifies the development process of high-bandwidth network interfaces
5. I/O Interfaces and On-chip Monitoring Module
- Configurable user I/O pins: 1248
Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all common single-ended and differential signal standards
The built-in system monitoring module continuously monitors the chip junction temperature, internal power supply voltage and external analog input signals in real time
Power Supply Characteristics
The nominal core operating voltage is between 0.85V and 0.9V. Logic fabric, block RAM, DSP arrays and serial transceivers adopt mutually isolated power domains, supporting partial module power-off to flexibly reduce overall power consumption
Typical total power consumption ranges from 21W to 58W. For continuous and stable full-load operation under the upper limit of industrial temperature, forced air cooling system must be equipped
Packaging and SMT Assembly Specifications
- Package form: 2577-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering work must be completed within 72 hours after the vacuum package is opened
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB production
Environmental Adaptability and Reliability
The chip can run stably for a long time under drastic temperature changes, mechanical shock, vibration and strong electromagnetic interference environments. It supports AES bitstream encryption, dynamic partial reconfiguration, SEU single-event upset detection and correction, with excellent radiation resistance, suitable for aerospace, military equipment and field industrial harsh environment deployment
Typical Application Scenarios
- Medium-scale ASIC and SoC hardware prototype verification and digital logic emulation platforms
- Core processing boards for carrier-grade optical communication and 100G network switching equipment
- Airborne radar signal preprocessing units and aerospace onboard payload data computing modules
- Ultra-wideband signal analyzers and high-precision spectrum testing instruments
- Military rugged VPX embedded computing mainboards
- High-speed data gateway equipment and industrial cryptographic acceleration hardware
