XCVU190-1FLGA2577I

Part Number Introduction

1. XCVU190: Mid-high capacity chip of Virtex UltraScale product line, equipped with complete high-speed interconnection architecture and abundant general resource allocation
2. -1: Speed Grade 1, low-power optimized version. It takes power consumption control and thermal stability as the primary goal instead of pursuing the highest operating frequency, perfectly matching devices with limited heat dissipation space and long continuous working time
3. FLGA2577: 2577-ball flip-chip FCBGA large package. Abundant pins support full layout of all on-chip transceivers, large-scale parallel signal access and docking of multi-channel high-speed memory interfaces
4. I: Industrial temperature grade, junction temperature working range: -40°C ~ +100°C

On-chip Hardware Resource Parameters

1. Programmable Logic Resources

• Total Logic Cells: 1938720
• Configurable CLB Slices: 110640
• Total Flip-Flops: 2212800
• Total LUTs: 1106400

2. Arithmetic and Memory Resources

• DSP48E2 arithmetic units: 1728 units, applicable to fixed-point and floating-point calculation, large-scale FFT operation, radar signal modulation and demodulation, encryption algorithm acceleration and medium and large matrix computing tasks
• Total Block RAM capacity: 53.2 Mb, used for large-capacity image frame cache, deep FIFO data buffer, waveform storage and algorithm parameter tables
• Distributed RAM capacity: 14.6 Mb, used for on-chip small temporary cache and lightweight asynchronous data interaction

3. Clock Management Subsystem

• 16 MMCM clock management tiles
• 16 PLL phase locked loops

  Users can configure multiple independent clock domains flexibly, realize clock phase fine adjustment, signal delay compensation and high-frequency jitter suppression, which meets the strict timing synchronization requirements of complex large-scale digital systems

4. High-speed Serial Transceivers

• 32 GTH differential high-speed transceivers

  The maximum transmission rate of each single lane reaches 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial communication protocols. The built-in hard Ethernet IP simplifies the development process of high-bandwidth network interfaces

5. I/O Interfaces and On-chip Monitoring Module

• Configurable user I/O pins: 1248

  Multiple I/O bank voltage domains cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all common single-ended and differential signal standards

  The built-in system monitoring module continuously monitors the chip junction temperature, internal power supply voltage and external analog input signals in real time

Power Supply Characteristics

Packaging and SMT Assembly Specifications

• Package form: 2577-pin FCBGA flip-chip ball grid array
• Moisture Sensitivity Level: MSL4. All reflow soldering work must be completed within 72 hours after the vacuum package is opened
• Lead-free packaging design, fully compliant with RoHS environmental standards
• Chips are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB production

Environmental Adaptability and Reliability

Skenario Aplikasi Umum

1. Medium-scale ASIC and SoC hardware prototype verification and digital logic emulation platforms
2. Core processing boards for carrier-grade optical communication and 100G network switching equipment
3. Airborne radar signal preprocessing units and aerospace onboard payload data computing modules
4. Ultra-wideband signal analyzers and high-precision spectrum testing instruments
5. Military rugged VPX embedded computing mainboards
6. High-speed data gateway equipment and industrial cryptographic acceleration hardware