XCKU3P-3SFVB784E

Manufacturer: Xilinx
Logic Cells: 3,780,000
Logic Slices: 590,000
Embedded RAM (eRAM): 81,360 Kb (2,260 × 36Kb Block RAM)
Maximum User I/O: 400
Package: SFVB784 (Flip-Chip BGA)
Speed Grade: -3
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCKU3P-3SFVB784E Kintex® UltraScale+ 20,34 -3,00 355,950 LE 31641600 304 0.873 V ~ 0.927 V Surface Mount 0 °C ~ +100 °C (E grade) 784-FCBGA 784-FCBGA