| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU3P-3SFVB784E | 킨텍스® 울트라스케일+ | 20,34 | -3,00 | 355,950 LE | 31641600 | 304 | 0.873V ~ 0.927V | 표면 실장 | 0°C ~ +100°C(E 등급) | 784-FCBGA | 784-FCBGA |
XCKU3P-3SFVB784E
제조업체: 자일링스
로직 셀: 3,780,000
로직 슬라이스: 590,000
임베디드 RAM(eRAM): 81,360Kb(2,260 × 36Kb 블록 RAM)
최대 사용자 I/O: 400
패키지: SFVB784(플립칩 BGA)
속도 등급: -3
작동 온도: 확장(0°C ~ +100°C)
사양
Part Number Explanation
This is AMD Xilinx Kintex UltraScale+ series low-power mid-range FPGA built on 16nm FinFET process, optimized for cost-sensitive embedded systems, portable signal processing and low-latency edge applications.
- XCKU3P: Entry-level Kintex UltraScale+ device with reduced power consumption
- -3: Speed Grade 3, power-optimized timing grade, prioritizes low power consumption over maximum operating frequency
- SFVB784: 784-ball flip-chip FCBGA compact package
- E: Extended industrial temperature grade, junction temperature range: -40°C ~ +125°C
On-Chip Core Hardware Resources
Logic & DSP Units
- Total Logic Cells: 221,280
- DSP48E2 dedicated arithmetic blocks: 1128 units
Used for digital filtering, FFT computation, sensor data processing, lightweight image algorithms and small-scale matrix calculations
임베디드 메모리
- Total Block RAM capacity: 14.5 Mb
Composed of independent 36K dual-port RAM banks for data buffering, FIFO storage and intermediate algorithm data caching
Distributed RAM implemented via LUT resources for ultra-low latency small temporary storage
클럭 관리 모듈
Integrated multiple MMCM and PLL clock management tiles. Capable of clock multiplication, division, arbitrary phase offset adjustment and jitter attenuation to satisfy multi-clock domain system design demands
High-Speed Transceivers & General I/O
- 8 GTH serial transceivers, maximum single lane rate up to 16.375 Gbps
Supports PCIe Gen3, Aurora, JESD204B, 10G Ethernet and other high-speed serial protocols
- Available user I/O pins: 324
Equipped with HR wide-voltage I/O banks and HP high-speed I/O banks; supports LVCMOS, LVDS, HSTL, SSTL and mainstream differential signaling standards
- Built-in SYSMON system monitor: tracks chip internal temperature, power supply voltages and external analog input signals in real time
전원 공급 장치 사양
Nominal core logic voltage: 0.85 V
Separate independent power domains are arranged for core logic, memory modules, transceivers and I/O interfaces. Dynamic voltage and frequency adjustment is supported to cut power consumption under light load.
Typical total power consumption: 9W ~ 28W, passive heat sink cooling is feasible for compact embedded hardware
포장 및 SMT 조립 요건
- Package: 784-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering operations must be completed within 168 hours after vacuum packaging is opened
- Lead-free design, fully compliant with RoHS environmental regulations
- Delivered in anti-static trays for automated industrial PCB mass production
Environmental and Reliability Features
Stable continuous operation is guaranteed under extreme temperature fluctuations and strong electromagnetic interference environments.
It supports 256-bit AES bitstream encryption for intellectual property protection, SEU radiation error correction and partial dynamic reconfiguration, perfectly suited for automotive electronics, outdoor industrial terminals and portable airborne equipment requiring high reliability.
일반적인 애플리케이션 시나리오
- Portable software-defined radio, miniature wireless signal transceiving and baseband preprocessing modules
- Embedded machine vision terminals, industrial portable defect inspection equipment
- Multi-channel portable data recorders, vibration monitoring and handheld precision measuring instruments
- Automotive peripheral control units, vehicle-mounted video preprocessing modules
- Miniature airborne signal acquisition and short-range radar front-end processing boards
- Low-cost PCIe data acquisition cards and custom embedded core system boards
