XCKU3P-3SFVB784E

Manufacturer: Xilinx
Logic Cells: 3,780,000
Logic Slices: 590,000
Embedded RAM (eRAM): 81,360 Kb (2,260 × 36Kb Block RAM)
Maximum User I/O: 400
Package: SFVB784 (Flip-Chip BGA)
Speed Grade: -3
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XCKU3P-3SFVB784EKintex® UltraScale+20,34-3,00355,950 LE316416003040.873 V ~ 0.927 VSurface Mount0 °C ~ +100 °C (E grade)784-FCBGA784-FCBGA