| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z035-2FFG900C | Zynq-7000 SoC | 42,98 | -2,00 | 275,000 LE | 17600000 | 0 | 1.0 V | SMD/SMT | Commercial (0 °C … 85 °C) | FCBGA-900 | FCBGA-900 |
XC7Z035-2FFG900C
Manufacturer: Xilinx
Logic Cells: 275,000
Logic Slices: 42,900
Embedded RAM (eRAM): 17,280 Kb (480 × 36Kb Block RAM)
Maximum User I/O: 300
Package: FFG900 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Commercial (0°C to +85°C)
Specifications
Part Number Decoding
This is Xilinx Zynq-7000 All Programmable SoC based on 28nm process, integrating dual-core ARM Cortex-A9 processor and large-scale Artix-7 FPGA logic resources, oriented to high-performance embedded vision, multi-channel data acquisition and industrial high-speed control systems.
- XC7Z035: High-end model of Zynq-7000 series
- -2: Speed Grade 2, enhanced timing performance with sufficient margin for high-frequency circuit design
- FFG900: 900-ball FCBGA flip-chip package
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Processor Part)
- Dual-core ARM Cortex-A9 processors, maximum operating frequency up to 1GHz
- Each core equipped with independent 32KB instruction cache + 32KB data cache; 512KB shared L2 cache
- Built-in NEON SIMD floating-point arithmetic accelerator for multimedia decoding, signal calculation acceleration
- Abundant standard peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC, CAN bus, UART, SPI, I2C, GPIO
- Supports secure boot mechanism to protect system startup security
2. Programmable Logic (PL: FPGA Part, Artix-7 Architecture)
- Total Logic Cells: 277,760
- DSP48E1 dedicated arithmetic blocks: 900 units, applicable to FFT operation, digital filtering, multi-channel image algorithm acceleration and matrix calculation
- Total Block RAM capacity: 17.0 Mb
- Multiple MMCM+PLL clock management modules, capable of generating multiple groups of clocks and suppressing clock jitter
- No built-in high-speed serial transceivers inside the chip
3. I/O Resources & On-Chip Monitoring Module
- Total available user configurable I/O pins: 500
- I/O banks support adjustable voltage ranging from 1.2V to 3.3V, compatible with LVCMOS, LVDS and various differential signal standards
- Embedded dual-channel 12-bit XADC analog monitoring unit: real-time collection of chip internal temperature, power supply voltage and external analog input signals
Power Supply Specifications
Nominal core logic voltage: 1.0V
Independent power domains are set for processor subsystem and programmable logic respectively.
Typical overall power consumption: 12W ~ 32W, heat sink cooling is required for long-term full-load operation
Packaging & SMT Assembly Requirements
- Package: 900-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering work must be finished within 168 hours after vacuum packaging is unsealed
- Lead-free packaging, fully compliant with RoHS environmental specifications
- Delivered in anti-static trays for automated PCB mass production
Environmental & Reliability Characteristics
Only suitable for stable indoor commercial and laboratory environments, cannot adapt to outdoor extreme temperature industrial scenarios.
With bitstream encryption protection and SEU error detection functions, it can operate stably for a long time in indoor industrial automation equipment, commercial vision terminals and desktop measurement instruments.
Typical Application Scenarios
- Multi-axis high-precision industrial motion controllers, factory production line core control units
- Multi-camera synchronous embedded machine vision inspection platforms, industrial high-speed image processing terminals
- Multi-channel high-speed data recorders, vibration and signal monitoring analytical instruments
- Medical indoor diagnostic equipment main control and medical image preprocessing modules
- Intelligent surveillance multi-channel video decoding and real-time analysis nodes
- High-performance embedded secondary development core boards and algorithm verification platforms
