XC7K160T-2FBG676E

Manufacturer: Xilinx
Logic Cells: 162,240
Logic Slices: 25,350
Embedded RAM (eRAM): 11,700 Kb (325 × 36Kb Block RAM)
Maximum User I/O: 400
Package: FBG676 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K160T-2FBG676E Kintex-7 12.675,00 -2,00 162,240 11980800 400 0.97 – 1.03 V (typ 1.0 V) Surface mount 0 °C — 100 °C 676-FBGA/FCBGA 676-FCBGA (27×27)