| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K160T-2FBG676E | 킨텍스-7 | 12.675,00 | -2,00 | 162,240 | 11980800 | 400 | 0.97 - 1.03V(통상 1.0V) | 표면 실장 | 0°C - 100°C | 676-FBGA/FCBGA | 676-FCBGA(27×27) |
사양
부품 번호 정의
This is a medium-density extended industrial temperature FPGA belonging to Xilinx Kintex-7 series, manufactured with mature 28nm semiconductor process technology. It achieves a balanced combination of logic resources, power consumption, cost and interface scalability, widely used in general industrial automation, wired communication gateway, data acquisition and portable test instruments requiring stable operation over wide temperature ranges.
- XC7K160T: Mid-density model of Kintex-7 family; suffix T stands for low-power optimized silicon version
- -2: Speed Grade 2, mainstream universal timing grade. Ample timing margin is reserved for most industrial digital logic designs, balancing operating frequency, timing stability and total power consumption reasonably
- FBG676: 676-ball flip-chip BGA package. Abundant pin resources support multi-channel parallel signal access and peripheral function expansion
- E: 확장 산업용 온도 등급, 작동 접합 온도 범위: -40°C ~ +100°C
온칩 하드웨어 리소스 사양
1. General Programmable Logic Resources
- Total Logic Cells: 162,240
- Configurable Slices: 25,350
- Total Flip-Flops: 202,800
- Total LUTs: 101,400
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 600 units, suitable for FFT calculation, digital filtering, motor control algorithms, sensor data convolution and moderate-scale matrix computation
- Total Block RAM Capacity: 11,682 Kb, used for data buffering, FIFO queues, waveform cache and system parameter storage
- Distributed RAM Capacity: 3,288 Kb
3. Clock Management Subsystem
- 8 MMCM clock management tiles
- 8 PLL phase locked loops
Supports multi-clock domain generation, phase adjustment, clock delay compensation and high-frequency jitter suppression, meeting timing synchronization demands of medium-scale embedded digital systems
4. 고속 직렬 트랜시버
- 8 GTX high-speed differential transceivers
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, Aurora and other mainstream serial communication protocols
5. I/O Interfaces & On-Chip Monitoring Module
- 구성 가능한 사용자 I/O 핀: 400
I/O bank voltage adjustable between 1.2V and 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
Built-in dual-channel 12-bit XADC analog monitor for real-time continuous detection of die junction temperature, internal power supply voltages and external analog input signals
전원 공급 장치 사양
Nominal core operating voltage: 1.0V
Independent isolated power domains are configured for logic fabric, Block RAM, DSP array and serial transceivers respectively
Typical overall power consumption: 4W ~ 16W; passive heat dissipation can meet conventional continuous working requirements under most industrial scenarios
포장 및 SMT 조립 요건
- 패키지 유형: 676핀 FCBGA 플립칩 볼 그리드 어레이
- 습기 민감도 등급: MSL3; 모든 리플로우 납땜 공정은 진공 포장을 개봉한 후 168시간 이내에 완료해야 합니다.
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays to prevent electrostatic damage during automated PCB mass production
환경 적응성 및 신뢰성
The chip runs stably for a long time under temperature fluctuation, mechanical vibration and moderate electromagnetic interference industrial environments. It supports 256-bit AES bitstream encryption and SEU single-event upset error detection, featuring strong anti-interference performance for field rugged devices.
일반적인 애플리케이션 시나리오
- Multi-axis servo motion controllers, industrial automation main control units
- Industrial Ethernet gateways, multi-protocol field bus conversion modules
- Multi-channel sensor data acquisition terminals, vibration and environmental monitoring equipment
- Small wireless communication auxiliary baseband processing boards
- Medical device data preprocessing and logic control modules
- Wide-temperature medium-performance industrial core boards and embedded algorithm verification platforms
