| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K160T-2FBG676E | Kintex-7 | 12.675,00 | -2,00 | 162,240 | 11980800 | 400 | 0,97 - 1,03 V (tip 1,0 V) | Yüzey montajı | 0 °C - 100 °C | 676-FBGA/FCBGA | 676-FCBGA (27×27) |
XC7K160T-2FBG676E
Üretici firma: Xilinx
Mantık Hücreleri: 162,240
Mantık Dilimleri: 25,350
Gömülü RAM (eRAM): 11.700 Kb (325 × 36Kb Blok RAM)
Maksimum Kullanıcı I/O: 400
Paket: FBG676 (Flip-Chip BGA)
Hız derecesi: -2
Çalışma Sıcaklığı: Genişletilmiş (0°C ila +100°C)
Teknik Özellikler
Parça Numarası Tanımı
This is a medium-density extended industrial temperature FPGA belonging to Xilinx Kintex-7 series, manufactured with mature 28nm semiconductor process technology. It achieves a balanced combination of logic resources, power consumption, cost and interface scalability, widely used in general industrial automation, wired communication gateway, data acquisition and portable test instruments requiring stable operation over wide temperature ranges.
- XC7K160T: Mid-density model of Kintex-7 family; suffix T stands for low-power optimized silicon version
- -2: Speed Grade 2, mainstream universal timing grade. Ample timing margin is reserved for most industrial digital logic designs, balancing operating frequency, timing stability and total power consumption reasonably
- FBG676: 676-ball flip-chip BGA package. Abundant pin resources support multi-channel parallel signal access and peripheral function expansion
- E: Extended industrial temperature grade, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Specifications
1. General Programmable Logic Resources
- Total Logic Cells: 162,240
- Configurable Slices: 25,350
- Total Flip-Flops: 202,800
- Total LUTs: 101,400
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 600 units, suitable for FFT calculation, digital filtering, motor control algorithms, sensor data convolution and moderate-scale matrix computation
- Total Block RAM Capacity: 11,682 Kb, used for data buffering, FIFO queues, waveform cache and system parameter storage
- Distributed RAM Capacity: 3,288 Kb
3. Clock Management Subsystem
- 8 MMCM clock management tiles
- 8 PLL phase locked loops
Supports multi-clock domain generation, phase adjustment, clock delay compensation and high-frequency jitter suppression, meeting timing synchronization demands of medium-scale embedded digital systems
4. High-Speed Serial Transceivers
- 8 GTX high-speed differential transceivers
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, Aurora and other mainstream serial communication protocols
5. I/O Interfaces & On-Chip Monitoring Module
- Configurable user I/O pins: 400
I/O bank voltage adjustable between 1.2V and 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
Built-in dual-channel 12-bit XADC analog monitor for real-time continuous detection of die junction temperature, internal power supply voltages and external analog input signals
Power Supply Specifications
Nominal core operating voltage: 1.0V
Independent isolated power domains are configured for logic fabric, Block RAM, DSP array and serial transceivers respectively
Typical overall power consumption: 4W ~ 16W; passive heat dissipation can meet conventional continuous working requirements under most industrial scenarios
Packaging & SMT Assembly Requirements
- Package Type: 676-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering processes must be completed within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays to prevent electrostatic damage during automated PCB mass production
Environmental Adaptability & Reliability
The chip runs stably for a long time under temperature fluctuation, mechanical vibration and moderate electromagnetic interference industrial environments. It supports 256-bit AES bitstream encryption and SEU single-event upset error detection, featuring strong anti-interference performance for field rugged devices.
Tipik Uygulama Senaryoları
- Multi-axis servo motion controllers, industrial automation main control units
- Industrial Ethernet gateways, multi-protocol field bus conversion modules
- Multi-channel sensor data acquisition terminals, vibration and environmental monitoring equipment
- Small wireless communication auxiliary baseband processing boards
- Medical device data preprocessing and logic control modules
- Wide-temperature medium-performance industrial core boards and embedded algorithm verification platforms
