XC5VLX330T-1FFG1738I

Manufacturer: Xilinx
Logic Cells: 326,080
Logic Slices: 52,000
Embedded RAM (eRAM): 13,440 Kb
Package: FFG1738 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX330T-1FFG1738IVirtex-5 LXT25.740,00-1,00331776119439369600.95 V – 1.05 VSurface Mount-40 °C ~ +100 °C (I)1738-BBGA / FCBGA1738-FCBGA (≈ 42.5 × 42.5 mm)

    XC5VLX330T-1FFG1738I FPGA – High-Density Solution

    • High logic capacity

    • Suitable for complex FPGA designs

    👉 Used in telecom & data processing.