XC5VLX30-1FFG676C

Manufacturer: Xilinx Logic Cells: 30,720 Logic Slices: 4,800 Embedded RAM (eRAM): 1,728 Kb (96 × 18Kb Block RAM) Package: FFG676 (Flip-Chip BGA) Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC5VLX30-1FFG676C Virtex-5 LX 2.400,00 -1,00 30720 1179648 400 0.95 V – 1.05 V Surface Mount 0 °C – +85 °C (C) 676-FBGA / FCBGA 676-FCBGA (≈27 × 27 mm)

    The XC5VLX30-1FFG676C is a cost-effective FPGA solution for commercial environments, ideal for designs that do not require extended temperature ranges.

    Applications

    • Consumer electronics (high-end embedded)

    • Communication modules

    • Interface control boards

    Practical Insight

    For indoor applications, many customers prefer the “C” version to reduce cost while maintaining design compatibility.