XC5VLX30-1FFG676C

Üretici firma: Xilinx Mantık Hücreleri: 30,720 Mantık Dilimleri: 4,800 Gömülü RAM (eRAM): 1.728 Kb (96 × 18Kb Blok RAM) Paket: FFG676 (Flip-Chip BGA) Çalışma Sıcaklığı: Ticari (0°C ila +85°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC5VLX30-1FFG676C Virtex-5 LX 2.400,00 -1,00 30720 1179648 400 0,95 V - 1,05 V Yüzey Montajı 0 °C - +85 °C (C) 676-FBGA / FCBGA 676-FCBGA (≈27 × 27 mm)

    The XC5VLX30-1FFG676C is a cost-effective FPGA solution for commercial environments, ideal for designs that do not require extended temperature ranges.

    Uygulamalar

    • Consumer electronics (high-end embedded)

    • Communication modules

    • Interface control boards

    Practical Insight

    For indoor applications, many customers prefer the “C” version to reduce cost while maintaining design compatibility.