XC5VLX30-1FFG676C

Manufacturer: Xilinx Logic Cells: 30,720 Logic Slices: 4,800 Embedded RAM (eRAM): 1,728 Kb (96 × 18Kb Block RAM) Package: FFG676 (Flip-Chip BGA) Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX30-1FFG676CVirtex-5 LX2.400,00-1,003072011796484000.95 V – 1.05 VSurface Mount0 °C – +85 °C (C)676-FBGA / FCBGA676-FCBGA (≈27 × 27 mm)

    The XC5VLX30-1FFG676C is a cost-effective FPGA solution for commercial environments, ideal for designs that do not require extended temperature ranges.

    Applications

    • Consumer electronics (high-end embedded)

    • Communication modules

    • Interface control boards

    Practical Insight

    For indoor applications, many customers prefer the “C” version to reduce cost while maintaining design compatibility.