XC4VLX100-10FF1148I

Manufacturer: Xilinx
Logic Cells: 110,592
Logic Slices: 49,152 (approx)
Embedded RAM (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
Package: FF1148 (Fine-Pitch BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC4VLX100-10FF1148I Virtex-4 LX 11.520,00 -10,00 99840 4478976 768 1.14 V ~ 1.26 V Surface Mount -40 °C ~ +100 °C (Industrial) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-10FF1148I: Industrial-Grade Logic Hub for Complex System Integration

    The XC4VLX100-10FF1148I is a high-density, mid-to-high range member of the Xilinx Virtex®-4 LX family. Built on the revolutionary 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device is engineered for architects who require substantial logic capacity—110,592 Logic Cells—without the extreme power and thermal footprint of the LX160 or LX200 variants.

    Designed for Industrial-grade (-40°C to +100°C) environments, this FPGA provides the reliability and timing stability necessary for mission-critical infrastructure, industrial automation, and ruggedized computing platforms.

    Core Engineering Highlights

    • Robust Logic-to-Memory Ratio: With 110,592 Logic Cells and 4,320 Kb of Block RAM, the LX100 offers an ideal environment for implementing large-scale state machines, complex custom RTL, and multi-protocol bridging.

    • Industrial Thermal Resilience: The -I rating ensures that the device maintains its -10 speed grade timing specifications even in high-heat industrial enclosures or unconditioned outdoor environments.

    • Advanced I/O Flexibility: Housed in the FF1148 Flip-Chip BGA package, the device breaks out 768 User I/Os. This high pin count is critical for interfacing with wide parallel buses (DDR2/QDR) and numerous differential pairs (LVDS/HSTL/SSTL).

    • XtremeDSP™ Hardware Acceleration: Integrated with 96 DSP48 slices, providing hard-coded arithmetic power for real-time signal processing, filtering, and 18×18 bit multiplications at frequencies up to 400MHz.

    • Precision Clock Management: Features Digital Clock Managers (DCMs) for sub-nanosecond skew control and frequency synthesis, ensuring stable synchronization across massive, multi-clock domain designs.


    Technical Specification Matrix

    Feature Specification
    Logic Cells 110,592
    CLB Array 12,480
    Total Block RAM 4,320 Kb
    DSP48 Slices 96
    User I/Os 768
    Speed Grade -10
    Temperature Grade Industrial (-40°C to +100°C)
    Package FF1148 (Flip-Chip BGA)

    Why Specify the LX100-10I?

    1. Optimized Routing Slack

    One of the major pain points in FPGA design is routing congestion. The LX100’s ASMBL architecture ensures that logic, memory, and DSP columns are interleaved, providing high routing transparency. Even at 80% utilization, this device maintains excellent timing closure characteristics.

    2. Signal Integrity and Reliability

    The FF1148 Flip-Chip package is designed with a high density of power and ground pins to mitigate Simultaneous Switching Noise (SSN). In industrial applications where electrical noise is a concern, the signal integrity provided by this package is a critical safeguard.

    3. Proven Longevity

    The Virtex-4 family is a mature and highly stable platform. For projects with 10–15 year life cycles—such as medical imaging backplanes or power grid monitoring—the LX100-10I offers a proven track record of field reliability and a well-documented toolchain.


    Ideal Applications

    • Industrial Automation: High-speed robotics and multi-axis motion control.

    • Telecommunications: Base station signal processing and localized switching.

    • Medical Systems: Ultrasound beamforming and real-time image reconstruction.

    • Aerospace & Defense: Ground support equipment and secure communication bridges.