XC4VLX100-10FF1148I

Üretici firma: Xilinx
Mantık Hücreleri: 110,592
Mantık Dilimleri: 49,152 (yaklaşık)
Gömülü RAM (eRAM): 4.320 Kb (240 × 18Kb Blok RAM)
Paket: FF1148 (Fine-Pitch BGA)
Çalışma Sıcaklığı: Endüstriyel (-40°C ila +100°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC4VLX100-10FF1148I Virtex-4 LX 11.520,00 -10,00 99840 4478976 768 1,14 V ~ 1,26 V Yüzey Montajı -40 °C ~ +100 °C (Endüstriyel) 1148-BBGA (FCBGA) 1148-FCBGA

    XC4VLX100-10FF1148I: Industrial-Grade Logic Hub for Complex System Integration

    Bu XC4VLX100-10FF1148I is a high-density, mid-to-high range member of the Xilinx Virtex®-4 LX family. Built on the revolutionary 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) architecture, this device is engineered for architects who require substantial logic capacity—110.592 Mantık Hücresi—without the extreme power and thermal footprint of the LX160 or LX200 variants.

    Designed for Industrial-grade (-40°C to +100°C) environments, this FPGA provides the reliability and timing stability necessary for mission-critical infrastructure, industrial automation, and ruggedized computing platforms.

    Temel Mühendislikte Öne Çıkanlar

    • Robust Logic-to-Memory Ratio: ile 110.592 Mantık Hücresi ve 4.320 Kb Blok RAM, the LX100 offers an ideal environment for implementing large-scale state machines, complex custom RTL, and multi-protocol bridging.

    • Endüstriyel Termal Esneklik: Bu -I rating ensures that the device maintains its -10 speed grade timing specifications even in high-heat industrial enclosures or unconditioned outdoor environments.

    • Advanced I/O Flexibility: Evin içinde FF1148 Flip-Chip BGA package, the device breaks out 768 Kullanıcı I/O'ları. This high pin count is critical for interfacing with wide parallel buses (DDR2/QDR) and numerous differential pairs (LVDS/HSTL/SSTL).

    • XtremeDSP™ Donanım Hızlandırma: ile entegre 96 DSP48 dilimi, providing hard-coded arithmetic power for real-time signal processing, filtering, and 18×18 bit multiplications at frequencies up to 400MHz.

    • Precision Clock Management: Özellikler Digital Clock Managers (DCMs) for sub-nanosecond skew control and frequency synthesis, ensuring stable synchronization across massive, multi-clock domain designs.


    Teknik Özellikler Matrisi

    Özellik Şartname
    Mantık Hücreleri 110,592
    CLB Dizisi 12,480
    Toplam Blok RAM 4,320 Kb
    DSP48 Dilimleri 96
    Kullanıcı I/O'ları 768
    Hız Sınıfı -10
    Sıcaklık Sınıfı Endüstriyel (-40°C ila +100°C)
    Paket FF1148 (Flip-Chip BGA)

    Why Specify the LX100-10I?

    1. Optimized Routing Slack

    One of the major pain points in FPGA design is routing congestion. The LX100’s ASMBL architecture ensures that logic, memory, and DSP columns are interleaved, providing high routing transparency. Even at 80% utilization, this device maintains excellent timing closure characteristics.

    2. Signal Integrity and Reliability

    Bu FF1148 Flip-Chip package is designed with a high density of power and ground pins to mitigate Eşzamanlı Anahtarlama Gürültüsü (SSN). In industrial applications where electrical noise is a concern, the signal integrity provided by this package is a critical safeguard.

    3. Proven Longevity

    The Virtex-4 family is a mature and highly stable platform. For projects with 10–15 year life cycles—such as medical imaging backplanes or power grid monitoring—the LX100-10I offers a proven track record of field reliability and a well-documented toolchain.


    Ideal Applications

    • Endüstriyel Otomasyon: High-speed robotics and multi-axis motion control.

    • Telekomünikasyon: Base station signal processing and localized switching.

    • Tıbbi Sistemler: Ultrasound beamforming and real-time image reconstruction.

    • Havacılık ve Savunma: Ground support equipment and secure communication bridges.